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HCPL4503

Description
Single Channel, High Speed Optocouplers
File Size150KB,16 Pages
ManufacturerHP(Keysight)
Websitehttp://www.semiconductor.agilent.com/
Download Datasheet View All

HCPL4503 Overview

Single Channel, High Speed Optocouplers

Single Channel, High Speed
Optocouplers
Technical Data
6N135/6
HCNW135/6
HCNW4502/3
HCPL-2502
HCPL-0452/3
HCPL-0500/1
HCPL-4502/3
Features
• 15 kV/
µ
s Minimum Common
Mode Transient Immunity at
V
CM
= 1500 V (4503/0453)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8-Pin DIP, SO-8,
Widebody Packages
• Open Collector Output
• Guaranteed Performance
from Temperature: 0
°
C
to 70
°
C
• Safety Approval
UL Recognized – 3750 V rms
for 1 minute (5000 V rms for
1 minute for HCNW and
Option 020 devices) per
UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved
–V
IORM
= 630 V
peak
for
HCPL-4503#060
–V
IORM
= 1414 V
peak
for
HCNW devices
• Dual Channel Version
Available (253X/4534/053X/
0534)
• MIL-PRF-38534 Hermetic
Version Available (55XX/
65XX/4N55)
Applications
• High Voltage Insulation
• Video Signal Isolation
• Power Transistor Isolation
in Motor Drives
• Line Receivers
• Feedback Element in
Switched Mode Power
Supplies
• High Speed Logic Ground
Isolation – TTL/TTL, TTL/
CMOS, TTL/LSTTL
• Replaces Pulse Transformers
• Replaces Slow
Phototransistor Isolators
• Analog Signal Ground
Isolation
Description
These diode-transistor optocoup-
lers use an insulating layer
between a LED and an integrated
photodetector to provide elec-
trical insulation between input
and output. Separate connections
for the photodiode bias and
output-transistor collector
increase the speed up to a
hundred times that of a conven-
tional phototransistor coupler by
reducing the base-collector
capacitance.
Functional Diagram
NC 1
ANODE 2
CATHODE 3
NC 4
8 V
CC
*
7 V
B
6 V
O
5 GND
TRUTH TABLE
(POSITIVE LOGIC)
V
O
LED
LOW
ON
HIGH
OFF
* NOTE: FOR 4502/3, 0452/3,
PIN 7 IS NOT CONNECTED.
A 0.1
µF
bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
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