EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-T0303AS-00-4643-F

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WBC-T0303AS-00-4643-F Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-T0303AS-00-4643-F - - View Buy Now

WBC-T0303AS-00-4643-F Overview

Resistor Networks & Arrays

WBC-T0303AS-00-4643-F Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
dspflash storage problem
The flash of tms320f2806 is 64Kx16bit, my program is 250KB, and I don't have external flash, why can it still hold my program? How big a program can this chip hold?...
奋进121 DSP and ARM Processors
[Review of Arteli Development Board AT32F421] + Simple application of timer
Generally in projects, especially in naked frameworks, timers are very commonly used. AT32F421 also has abundant timer resources. 10 timers are available. Different functions have different effects. O...
西点钟灵毓秀 Domestic Chip Exchange
List of basic instruments and main components for the 2013 National Electronic Design Competition (for reference)
[i=s]This post was last edited by paulhyde on 2014-9-15 03:42[/i]...
paulhyde Electronics Design Contest
Technical foundation of multi-core DSP
[color=#252525]The progress of chip manufacturing process technology and the improvement of SoC design and verification level are the "hardware" and "software" foundations for the birth of multi-core ...
Jacktang DSP and ARM Processors
Unable to install
Why can't I install the SOCEDS I downloaded from the rocketboard website on my linnux computer? It says that the binary file cannot be executed. What does this mean?...
wenchao1991 FPGA/CPLD
[TI Wireless Theme Collection] Application of cc2530ZigBee in Small Test Room
The company has a small circuit test room, and the test machine needs to be monitored in real time! Originally, workers were on duty, and they would forget things! The current design is that each test...
alex120 Wireless Connectivity

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 559  2535  1616  990  2575  12  52  33  20  16 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号