KMPC880CZP66 datasheet, PDF - EEWORLD Datasheet

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KMPC880CZP66: DescriptionMicroprocessors - MPU PQ I HIP6W DUET; CategoryThe embedded processor and controller Microcontrollers and processors; File Size938KB，87 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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KMPC880CZP66 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	BGA, BGA357,19X19,50
Contacts	357
Reach Compliance Code	not_compliant
ECCN code	5A992
Address bus width	32
bit size	32
boundary scan	YES
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B357
JESD-609 code	e0
length	25 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	357
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA357,19X19,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	245
power supply	1.8,3.3 V
Certification status	Not Qualified
Maximum seat height	2.52 mm
speed	66 MHz
Maximum supply voltage	1.9 V
Minimum supply voltage	1.7 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Freescale Semiconductor

Technical Data

Document Number: MPC885EC

Rev. 7, 07/2010

MPC885/MPC880 PowerQUICC

Hardware Specifications

This hardware specification contains detailed information on

power considerations, DC/AC electrical characteristics, and

AC timing specifications for the MPC885/MPC880. The

MPC885 is the superset device of the MPC885/MPC880

family. The CPU on the MPC885/MPC880 is a 32-bit core

built on Power Architecture™ technology that incorporates

memory management units (MMUs) and instruction and

data caches. For functional characteristics of the

MPC885/MPC880, refer to the

MPC885 PowerQUICC

Family Reference Manual.

To locate published errata or updates for this document, refer

to the MPC875/MPC870 product summary page on our

website listed on the back cover of this document or, contact

your local Freescale sales office.

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Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 9

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 10

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Thermal Calculation and Measurement . . . . . . . . . . 12

Power Supply and Power Sequencing . . . . . . . . . . . 15

Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 16

IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 44

CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 46

UTOPIA AC Electrical Specifications . . . . . . . . . . . 69

USB Electrical Characteristics . . . . . . . . . . . . . . . . . 71

FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 71

Mechanical Data and Ordering Information . . . . . . . 75

Document Revision History . . . . . . . . . . . . . . . . . . . 85

KMPC880CZP66 Related Products

	KMPC880CZP66	KMPC885VR133	KMPC880ZP133	KMPC880CVR133	KMPC880CZP133	KMPC885VR66	KMPC885CZP133	KMPC885ZP80	KMPC880VR66
Description	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET	Microprocessors - MPU PQ I HIP6W DUET
Is it Rohs certified?	incompatible	conform to	incompatible	conform to	incompatible	conform to	incompatible	incompatible	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA357,19X19,50	LEAD FREE, PLASTIC, BGA-357	BGA, BGA357,19X19,50	LEAD FREE, PLASTIC, BGA-357	BGA, BGA357,19X19,50	LEAD FREE, PLASTIC, BGA-357	BGA, BGA357,19X19,50	BGA, BGA357,19X19,50	LEAD FREE, PLASTIC, BGA-357
Contacts	357	357	357	357	357	357	357	357	357
Reach Compliance Code	not_compliant	unknown	not_compliant	unknown	not_compliant	unknown	not_compliant	not_compliant	unknown
ECCN code	5A992	5A002	5A992	5A992	5A992	5A002	5A002	5A002	5A992
Address bus width	32	32	32	32	32	32	32	32	32
bit size	32	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
External data bus width	32	32	32	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357
JESD-609 code	e0	e1	e0	e1	e0	e1	e0	e0	e1
length	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of terminals	357	357	357	357	357	357	357	357	357
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	245	245	245	245	245	260	245	245	245
power supply	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm
speed	66 MHz	133 MHz	133 MHz	133 MHz	133 MHz	66 MHz	133 MHz	80 MHz	66 MHz
Maximum supply voltage	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	TIN LEAD	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD	TIN LEAD	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	40	30	30	30
width	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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