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3SMBJ5917B-TP

Description
Zener Diodes
CategoryDiscrete semiconductor    diode   
File Size243KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
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3SMBJ5917B-TP Overview

Zener Diodes

3SMBJ5917B-TP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AA
package instructionSMB, 2 PIN
Contacts2
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance5 Ω
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
Certification statusNot Qualified
Nominal reference voltage4.7 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current79.8 mA
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMBJ5913B
THRU
3SMBJ5943B
3.0 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Features
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
3.3thru
56
Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
Available on Tape and Reel
Mechanical Data
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
and MSL rating 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
A
Maximum temperature for soldering: 260
0
C for 10 seconds.
Maximum Ratings @ 25
o
C Unless Otherwise Specified
C
B
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
V
F
P
d
T
J
, T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
D
F
H
G
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
Note:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
3.
Forward Current @ 200mA.
Mounted on 5.0mm (1oz thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
Revision:
8
www.mccsemi.com
1 of 4
2010/04/13
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