Edition 2010-09-20
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
TLE4966-3K
Revision History: 2010-09-20, Rev.1.0
Previous Revision:
Page
Subjects (major changes since last revision)
Trademarks of Infineon Technologies AG
ABM™, BlueMoon™, CONVERGATE™, COSIC™, C166™, FALC™, GEMINAX™, GOLDMOS™, ISAC™,
OMNITUNE™, OMNIVIA™, PROSOC™, SEROCCO™, SICOFI™, SIEGET™, SMARTi™, SMINT™,
SOCRATES™, VINAX™, VINETIC™, VOIPRO™, X-GOLD™, XMM™, X-PMU™, XWAY™
Other Trademarks
Microsoft
®
, Visio
®
, Windows
®
, Windows Vista
®
, Visual Studio
®
, Win32
®
of Microsoft Corporation. Linux
®
of
Linus Torvalds. FrameMaker
®
, Adobe
®
Reader™, Adobe Audition
®
of Adobe Systems Incorporated. APOXI
®
,
COMNEON™ of Comneon GmbH & Co. OHG. PrimeCell
®
, RealView
®
, ARM
®
, ARM
®
Developer Suite™ (ADS),
Multi-ICE™, ARM1176JZ-S™, CoreSight™, Embedded Trace Macrocell™ (ETM), Thumb
®
, ETM9™, AMBA™,
ARM7™, ARM9™, ARM7TDMI-S™, ARM926EJ-S™ of ARM Limited. OakDSPCore
®
, TeakLite
®
DSP Core,
OCEM
®
of ParthusCeva Inc. IndoorGPS™, GL-20000™, GL-LN-22™ of Global Locate. mipi™ of MIPI Alliance.
CAT-iq™ of DECT Forum. MIPS™, MIPS II™, 24KEc™, MIPS32
®
, 24KEc™ of MIPS Technologies, Inc. Texas
Instruments
®
, PowerPAD™, C62x™, C55x™, VLYNQ™, Telogy Software™, TMS320C62x™, Code Composer
Studio™, SSI™ of Texas Instruments Incorporated. Bluetooth
®
of Bluetooth SIG, Inc. IrDA
®
of the Infrared Data
Association. Java™, SunOS™, Solaris™ of Sun Microsystems, Inc. Philips
®
, I2C-Bus
®
of Koninklijke Philips
Electronics N.V. Epson
®
of Seiko Epson Corporation. Seiko
®
of Kabushiki Kaisha Hattori Seiko Corporation.
Panasonic
®
of Matsushita Electric Industrial Co., Ltd. Murata
®
of Murata Manufacturing Company. Taiyo Yuden™
of Taiyo Yuden Co., Ltd. TDK
®
of TDK Electronics Company, Ltd. Motorola
®
of Motorola, Inc. National
Semiconductor
®
, MICROWIRE™ of National Semiconductor Corporation. IEEE
®
of The Institute of Electrical and
Electronics Engineers, Inc. Samsung
®
, OneNAND
®
, UtRAM
®
of Samsung Corporation. Toshiba
®
of Toshiba
Corporation. Dallas Semiconductor
®
, 1-Wire
®
of Dallas Semiconductor Corp. ISO
®
of the International
Organization for Standardization. IEC™ of the International Engineering Consortium. EMV™ of EMVCo, LLC.
Zetex
®
of Zetex Semiconductors. Microtec
®
of Microtec Research, Inc. Verilog
®
of Cadence Design Systems, Inc.
ANSI
®
of the American National Standards Institute, Inc. WindRiver
®
and VxWorks
®
of Wind River Systems, Inc.
Nucleus™ of Mentor Graphics Corporation. OmniVision
®
of OmniVision Technologies, Inc. Sharp
®
of Sharp
Corporation. Symbian OS
®
of Symbian Software Ltd. Openwave
®
of Openwave Systems, Inc. Maxim
®
of Maxim
Integrated Products, Inc. Spansion
®
of Spansion LLC. Micron
®
, CellularRAM
®
of Micron Technology, Inc.
RFMD
®
of RF Micro Devices, Inc. EPCOS
®
of EPCOS AG. UNIX
®
of The Open Group. Tektronix
®
of Tektronix,
Inc. Intel
®
of Intel Corporation. Qimonda
®
of Qimonda AG. 1GOneNAND
®
of Samsung Corporation.
HyperTerminal
®
of Hilgraeve, Inc. MATLAB
®
of The MathWorks, Inc. Red Hat
®
of Red Hat, Inc. Palladium
®
of
Cadence Design Systems, Inc. SIRIUS Satellite Radio
®
of SIRIUS Satellite Radio Inc. TOKO
®
of TOKO Inc.
The information in this document is subject to change without notice.
Last Trademarks Update 2008-11-17
Datasheet
3
Rev.1.0, 2010-09-20
TLE4966-3K
Trademarks of Infineon Technologies AG . . . . . . . . . . . . . . . . . . . . . . 3
1
1.1
1.2
1.3
2
2.1
2.2
2.3
3
4
5
6
7
7.1
7.2
7.3
Overview
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
5
5
6
7
7
7
8
Maximum Ratings
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Operating Range
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical and Magnetic Parameters
. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Field Direction Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Timing Diagrams for the Speed and Direction Output
. . . . . . . . . . . . . 11
Package Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Distance between Chip and Package Surface . . . . . . . . . . . . . . . . . . . . . .
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCB Footprint for PG-TSOP-6-6-5 . . . . . . . . . . . . . . . . . . . . . . . . . .
13
13
13
13
14
Datasheet
4
Rev.1.0, 2010-09-20
High Sensitivity Automotive Hall Switch with direction
detection
TLE4966-3K
1
1.1
•
•
•
•
•
•
•
•
•
•
•
•
•
Overview
Features
2.7V to 24V supply voltage operation
Operation from unregulated power supply
High sensitivity and high stability
of the magnetic switching points
High resistance to mechanical stress
by Active Error Compensation
Reverse battery protection (-18V)
Superior temperature stability
Peak temperatures up to 195°C
Low jitter (typ. 1μs)
Digital output signals
Excellent matching of the 2 Hall probes
Hall plate distance 1.45mm
Speed and direction output signal
SMD package PG-TSOP-6-6-5
1.2
Functional Description
The TLE4966-3K is an integrated circuit dual Hall-effect sensor designed specifically for highly accurate
applications which use a rotating pole wheel. Precise magnetic switching points and high temperature stability are
achieved by active compensation circuits and chopper techniques on chip. The sensor provides a speed output
at Q2 with the status (high or low) corresponding to the magnetic field value. For positive magnetic fields (south
pole) exceeding the threshold B
OP
the output is low, whereas for negative magnetic fields (north pole) lower than
B
RP
the output switches to high. The output Q1 can be either high or low depending on the direction of rotation of
the pole wheel. This direction information is calculated internally.
Product Name
TLE4966-3K
Datasheet
Product Type
Double Hall Switch
5
Ordering Code
SP000835522
Package
PG-TSOP-6-6-5
Rev.1.0, 2010-09-20
Embedded System
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