EEWORLDEEWORLDEEWORLD

Part Number

Search

504195-0770

Description
Headers & Wire Housings EMBS PACKAGE FOR 504195 7P
CategoryThe connector   
File Size25KB,2 Pages
ManufacturerMolex
Websitehttps://www.molex.com/molex/home
Environmental Compliance
Download Datasheet Parametric View All

504195-0770 Online Shopping

Suppliers Part Number Price MOQ In stock  
504195-0770 - - View Buy Now

504195-0770 Overview

Headers & Wire Housings EMBS PACKAGE FOR 504195 7P

504195-0770 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerMolex
Product CategoryHeaders & Wire Housings
RoHSDetails
ProductHeaders
TypeShrouded
Number of Positions7 Position
Pitch1.25 mm
Number of Rows1 Row
Mounting StyleSMD
Termination StyleSMD/SMT
Mounting AngleRight Angle
Contact GenderPin (Male)
Contact PlatingTin
PackagingReel
Accessory Type-
ApplicationWire-to-Board
Contact Type-
Current Rating1.5 A
Housing MaterialPolyamide (PA)
Voltage Rating50 V
Contact MaterialBrass
Row Spacing-
Housing Gender-
Maximum Operating Temperature+ 85 C
Minimum Operating Temperature- 25 C
Factory Pack Quantity1200
Unit Weight0.008200 oz
This document was generated on 02/27/2018
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
5041950770
Active
Micro-Lock™ Connectors
Micro-Lock 1.25mm Pitch Single-Row Right-Angle Header, Beige, 7 Circuits,
5041950770
Documents:
3D Model
Drawing (PDF)
Product Specification PS-504193-001-001 (PDF)
Application Specification AS-504193-001-001 (PDF)
General
Product Family
Series
Application
Overview
Product Name
UPC
Physical
Breakaway
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Glow-Wire Capable
Guide to Mating Part
Lock to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Net Weight
Number of Rows
Orientation
PC Tail Length
PCB Locator
PCB Retention
PCB Thickness - Recommended
Packaging Type
Pitch - Mating Interface
Pitch - Termination Interface
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Material Info
Reference - Drawing Numbers
Application Specification
Packaging Specification
Product Specification
Sales Drawing
Application Specification AS-504193-002-001 (PDF)
Packaging Specification SPK-504195-001-001 (PDF)
RoHS Certificate of Compliance (PDF)
Series image - Reference only
EU ELV
Not Relevant
EU RoHS
China RoHS
Compliant
REACH SVHC
Not Contained Per -
ED/30/2017 (7 July
2017)
Halogen-Free
Status
Not Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
Please visit the Contact Us section for any
non-product compliance questions.
China ROHS
ELV
RoHS Phthalates
Green Image
Not Relevant
Not Contained
PCB Headers
504195
Wire-to-Board
Micro-Lock™ Connectors
Micro-Lock
887191210643
No
7
7
Beige
30
No
No
No
Yes
Brass
Tin
Nickel
232.473/mg
1
Right Angle
3.00mm
No
None
1.20mm, 1.60mm
Embossed Tape on Reel
1.25mm
1.25mm
-25°C to +85°C
Surface Mount
1.5A
50V
Search Parts in this Series
504195 Series
Mates With
504193 Micro-Lock Wire-to-Board Crimp
Housing
AS-504193-001-001, AS-504193-002-001
SPK-504195-001-001
PS-504193-001-001
SD-504195-001, SD-504195-002
EEWORLD University Hall----STM32 L0 ultra-low power consumption new breakthrough
STM32 L0 ultra-low power consumption new breakthrough : https://training.eeworld.com.cn/course/2263STM32 L0 ultra-low power consumption new breakthrough...
chenyy MCU
Will one processor rule the world?
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:54[/i][color=#333333][font=Arial, Helvetica, sans-serif, 宋体]· The ARM 32-bit architecture is now the strongest candidate to replace the...
wstt Mobile and portable
Which environment setup tutorial should I watch? -- ESP series development environment setup video navigation directory
I want to use Espressif's chips for development. I know the first step is to build the development environment required for developing ESP series chips, but I don't know how to build it? I read the pr...
谍纸天眼 Domestic Chip Exchange
Real-time imaging of linear frequency modulation pulse train synthetic aperture radar
Abstract: The principle of improving the range resolution of linear frequency modulation (L,FM) pulse train synthetic aperture radar (SAR) is introduced, and the signal processing algorithm and steps ...
JasonYoo Embedded System
How to distinguish between USB flash drives and mobile hard drives in DDK?
I use IOCTL_STORAGE_QUERY_PROPERTY in the filter driver to get the bus information of the device. The bus types of USB flash drives and mobile hard drives are both 7, and the local hard drive is 3. No...
qianlidou Embedded System
CC2640R2F-Q1 uses low-power Bluetooth technology to transform car access control systems
The automotive industry is undergoing a major transformation to meet consumers’ desire to replace car keys with smartphones. With the popularization of “phone as key” technology, you no longer need tr...
Jacktang Wireless Connectivity

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1501  2738  2901  142  874  31  56  59  3  18 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号