5962-8966605XA datasheet, PDF - EEWORLD Datasheet

5962-8966605XA: DescriptionFIFO, 256X9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28; Categorystorage; File Size459KB，14 Pages; ManufacturerIDT (Integrated Device Technology)

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5962-8966605XA Overview

FIFO, 256X9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28

Parameter Name	Attribute value
Maker	IDT (Integrated Device Technology)
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	40 ns
Other features	RETRANSMIT
period time	50 ns
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
memory density	2304 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X9
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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