74FCT533ALCX datasheet, PDF - EEWORLD Datasheet

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74FCT533ALCX: DescriptionIC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC; Categorylogic; File Size389KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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74FCT533ALCX Overview

IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC

74FCT533ALCX Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCN, LCC20,.35SQ
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	S-XQCC-N20
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.048 A
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC20,.35SQ
Package shape	SQUARE
Package form	CHIP CARRIER
method of packing	TAPE AND REEL
power supply	5 V
Prop。Delay @ Nom-Sup	5.2 ns
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

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Description	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	54FCT533DMQR	54FCT533LMQR	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	54FCT533FMQR	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC
package instruction	QCCN, LCC20,.35SQ	DIP, DIP20,.3	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	DIP, DIP20,.3	DFP, FL20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-XQCC-N20	R-PDIP-T20	S-XQCC-N20	S-XQCC-N20	R-XDIP-T20	R-XDFP-F20	R-XDIP-T20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.048 A	0.048 A	0.048 A	0.032 A	0.032 A	0.048 A	0.048 A
Number of digits	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	DIP	QCCN	QCCN	DIP	DFP	DIP
Encapsulate equivalent code	LCC20,.35SQ	DIP20,.3	LCC20,.35SQ	LCC20,.35SQ	DIP20,.3	FL20,.3	DIP20,.3
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	FLATPACK	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	FLAT	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1
Is it Rohs certified?	incompatible	incompatible	incompatible	-	-	incompatible	incompatible
Maker	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments	-
JESD-609 code	e0	e0	e0	-	-	e0	e0
Prop。Delay @ Nom-Sup	5.2 ns	-	10 ns	-	-	10 ns	5.2 ns
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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