54FCT533DMQR datasheet, PDF - EEWORLD Datasheet

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54FCT533DMQR: Description54FCT533DMQR; Categorylogic logic; File Size389KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54FCT533DMQR Overview

54FCT533DMQR

54FCT533DMQR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknow
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.048 A
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Su	10 ns
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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Description	54FCT533DMQR	54FCT533LMQR	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	54FCT533FMQR	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC
package instruction	DIP, DIP20,.3	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	DIP, DIP20,.3	DFP, FL20,.3	QCCN, LCC20,.35SQ	DIP, DIP20,.3
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T20	S-XQCC-N20	S-XQCC-N20	R-XDIP-T20	R-XDFP-F20	S-XQCC-N20	R-XDIP-T20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.048 A	0.048 A	0.032 A	0.032 A	0.048 A	0.048 A	0.048 A
Number of digits	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	QCCN	QCCN	DIP	DFP	QCCN	DIP
Encapsulate equivalent code	DIP20,.3	LCC20,.35SQ	LCC20,.35SQ	DIP20,.3	FL20,.3	LCC20,.35SQ	DIP20,.3
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1
Is it Rohs certified?	incompatible	incompatible	-	-	incompatible	incompatible	incompatible
JESD-609 code	e0	e0	-	-	e0	e0	e0
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Prop。Delay @ Nom-Sup	-	10 ns	-	-	10 ns	5.2 ns	5.2 ns
Maker	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-

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