SMT Power Inductor
High Current Molded Power Inductor - PA4340.XXXNLT Series
Height: 3.0mm Max
Footprint: 6.0mm x 5.4mm Max
Current Rating: up to 23A
Inductance Range: 0.10uH to 33uH
Shielded construction and compact design
High current, low DCR, and high efficiency
Minimized acoustic noise and minimized leakage flux
200Vdc Isolation between terminal and core
Electrical Specifications @ 25°C - Operating Temperature -55°C to +125°C
Part
Number
PA4340.101NLT
PA4340.201NLT
PA4340.221NLT
PA4340.331NLT
PA4340.471NLT
PA4340.681NLT
PA4340.102NLT
PA4340.122NLT
PA4340.152NLT
PA4340.222NLT
PA4340.332NLT
PA4340.472NLT
PA4340.562NLT
PA4340.682NLT
PA4340.103NLT
PA4340.153NLT
PA4340.183NLT
PA4340.223NLT
PA4340.333NLT
Inductance
100KHz, 1V
uH
0.10±30%
0.20±30%
0.22±30%
0.33±20%
0.47±20%
0.68±20%
1.00±20%
1.20±20%
1.50±20%
2.20±20%
3.30±20%
4.70±20%
5.60±20%
6.80±20%
10.00±20%
15.0±20%
18.0±20%
22.0±20%
33.0±20%
Rated
Current
A
23.0
16.0
15.5
14.0
12.0
8.5
7.0
6.5
6.0
5.5
5.0
4.6
4.25
4.0
2.75
2.1
2.0
1.9
1.6
DC
Resistance
MAX.
mΩ
3.0
3.2
4.4
5.0
7.4
12.0
14.0
16.0
25.0
35.0
38.0
53.0
63.0
76.2
128.0
190.0
230.0
250.0
440.0
TYP.
mΩ
2.5
2.6
3.7
4.3
6.4
10.0
13.0
14.0
16.0
25.0
32.0
50.0
55.0
68.0
110.0
165.0
195.0
220.0
380.0
Saturation
Current
Max.
A
27.0
25.0
21.0
18.0
16.0
14.0
11.0
11.0
10.0
9.0
8.0
6.0
4.5
4.3
3.5
2.6
2.3
1.7
1.6
1
power.pulseelectronics.com
P767.H(12/17)
P767.G (11/17)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4340.XXXNLT Series
Notes:
1. Actual temperature of the component during system operation (ambient plus tempera- 3.
ture rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approximately
30% at the stated ambient temperature. This current is determined by placing the com-
ponent in the specified ambient environment and applying a short duration pulse cur- 4.
rent (to eliminate self-heating effect) to the component.
The rated current is the DC current required to raise the component temperature by
approximately 40°C. Take note that the components’ performanc varies depending on the
system condition. It is suggested that the component be tested at the system level, to
verify the temperature rise of the component during system operation.
The part temperature (ambient+temp rise) should not exceed 125°C under worst case
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all affect the part temperature. Part temperature should be verified in the
end application.
Mechanical
PA4340.XXXNLT
Final Layout
Series
PA4340.XXXNLT
All Dimensions in mm.
A
6.0 MAX
B
5.4 MAX
C
3.0 MAX
D
(1.5)
E
3.5 MAX
F
(1.8)
SUGGESTED PAD LAYOUT
G
(2.0)
H
(2.5)
TAPE & REEL INFO
T
E
P
2
P
0
ØD
0
B
F
W
A
N
K
0
P
1
G
SURFACE MOUNTING TYPE, REEL/TAPE LIST
REEL SIZE (mm)
A
PA4340.XXXNLT
Ø330
B
N/A
G
12
N
100
E
1.75
F
3.5
5.5
D
0
1.5
TAPE SIZE (mm)
P
1
8
P
0
4
P
2
2
W
8
12
T
0.35
K
0
3.3
QTY
PCS/REEL
2000
2
power.pulseelectronics.com
P767.H(12/17)
P767.G (11/17)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4340.XXXNLT Series
Typical Performance Curves
3
power.pulseelectronics.com
P767.H(12/17)
P767.G (11/17)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4340.XXXNLT Series
4
power.pulseelectronics.com
P767.H(12/17)
P767.G (11/17)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4340.XXXNLT Series
5
power.pulseelectronics.com
P767.H(12/17)
P767.G (11/17)
http://www.power.pulseelectronics.com/contact
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