Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range............................ -65°C to +160°C
Lead Temperature (soldering, 10s) ........ Reflow Profile (Note 1)
Soldering Temperature (reflow) ......................................+260°C
Note 1:
Refer to Application Note 1891:
Wafer-Level Packaging (WLP) and Its Applications.
CAUTION!
ESD SENSITIVE DEVICE
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX2691 EV kit, V
CC
= 1.6V to 3.6V, T
A
= -40°C to +85°C, no RF signals are applied. Typical values are at V
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Mobile and portable
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