MMSD4148T1G,
SMMSD4148T1G,
MMSD4148T3G,
SMMSD4148T3G
Switching Diode
http://onsemi.com
Features
SOD−123 Surface Mount Package
High Breakdown Voltage
Fast Speed Switching Time
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
(Note 1)
t < 1 sec
t = 1
msec
Symbol
V
R
I
F
I
FSM
T
J
, T
stg
Value
100
200
1.0
2.0
−55
to
+150
Unit
V
mA
A
C
SOD−123
CASE 425
STYLE 1
1
CATHODE
2
ANODE
MARKING DIAGRAM
1
5I M
G
G
= Device Code
= Date Code
= Pb−Free Package
Operating and Storage Junction Temperature
Range
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board (Note 2)
T
A
= 25C
Derate above 25C
Thermal Resistance Junction−to−Ambient
Symbol
P
D
Max
425
3.4
R
qJA
290
Unit
mW
mW/C
C/W
5I
M
G
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MMSD4148T1G
SMMSD4148T1G
MMSD4148T3G
SMMSD4148T3G
Package
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
Shipping
†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Typical Values
2. FR−5 = 1.0 oz Cu, 1.0 in
z
pad
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011
−
Rev. 11
1
Publication Order Number:
MMSD4148T1/D
MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I
BR
= 100
mA)
Reverse Voltage Leakage Current
(V
R
= 20 V)
(V
R
= 75 V)
Forward Voltage
(I
F
= 10 mA)
Diode Capacitance
(V
R
= 0 V, f = 1.0 MHz)
Reverse Recovery Time
(I
F
= I
R
= 10 mA) (Figure 1)
V
(BR)
I
R
100
−
−
−
−
−
−
25
5.0
1000
4.0
4.0
V
Symbol
Min
Max
Unit
nA
mA
mV
pF
ns
V
F
C
D
t
rr
820
W
+10 V
2k
100
mH
0.1
mF
DUT
50
W
OUTPUT
PULSE
GENERATOR
50
W
INPUT
SAMPLING
OSCILLOSCOPE
90%
V
R
INPUT SIGNAL
I
R
i
R(REC)
= 1 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; measured
at i
R(REC)
= 1 mA)
I
F
0.1
mF
t
r
10%
t
p
t
I
F
t
rr
t
1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
http://onsemi.com
2
MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G
100
IF, FORWARD CURRENT (mA)
I R, REVERSE CURRENT (
A)
10
T
A
= 150C
1.0
T
A
= 125C
10
T
A
= 85C
T
A
= - 40C
0.1
T
A
= 85C
1.0
T
A
= 25C
T
A
= 55C
0.01
T
A
= 25C
0.1
0.2
0.4
0.6
0.8
1.0
1.2
0.001
0
10
20
30
40
50
V
F
, FORWARD VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
CD , DIODE CAPACITANCE (pF)
0.64
0.60
0.56
0.52
0
2
4
6
8
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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3
MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
D
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
c
D
E
H
E
L
q
MIN
0.94
0.00
0.51
---
1.40
2.54
3.56
0.25
0
MILLIMETERS
NOM
MAX
1.17
1.35
0.05
0.10
0.61
0.71
---
0.15
1.60
1.80
2.69
2.84
3.68
3.86
---
---
---
10
MIN
0.037
0.000
0.020
---
0.055
0.100
0.140
0.010
0
INCHES
NOM
0.046
0.002
0.024
---
0.063
0.106
0.145
---
---
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
---
10
H
E
2.36
0.093
4.19
0.165
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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4
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2
1
E
q
b
C
L
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.91
0.036
1.22
0.048
SCALE 10:1
mm
inches
MMSD4148T1/D
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