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HY57V561620BLT-HI

Description
4 Banks x 4M x 16Bit Synchronous DRAM
Categorystorage    storage   
File Size156KB,12 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
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HY57V561620BLT-HI Overview

4 Banks x 4M x 16Bit Synchronous DRAM

HY57V561620BLT-HI Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeTSOP2
package instructionTSOP2, TSOP54,.46,32
Contacts54
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PDSO-G54
JESD-609 codee6
length22.238 mm
memory density268435456 bi
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals54
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP54,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height1.194 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.001 A
Maximum slew rate0.22 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN BISMUTH
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
width10.16 mm
HY57V561620B(L)T-I
4 Banks x 4M x 16Bit Synchronous DRAM
DESCRIPTION
The HY57V561620B-I is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require
large memory density and high bandwidth. HY57V561620B is organized as 4banks of 4,194,304x16.
HY57V561620B-I is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchro-
nized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output
voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated by
a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(sequential or interleave). A burst of read or
write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst read or
write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)
FEATURES
Single 3.3±0.3V power supply
All device pins are compatible with LVTTL interface
JEDEC standard 400mil 54pin TSOP-II with 0.8mm of pin
pitch
All inputs and outputs referenced to positive edge of sys-
tem clock
Data mask function by UDQM, LDQM
Internal four banks operation
Auto refresh and self refresh
8192 refresh cycles / 64ms
Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or Full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
Programmable CAS Latency ; 2, 3 Clocks
Ambient Temperature : - 40 ~ 85
°C
ORDERING INFORMATION
Part No.
HY57V561620BT-6I
HY57V561620BT-KI
HY57V561620BT-HI
HY57V561620BT-8I
HY57V561620BT-PI
HY57V561620BT-SI
HY57V561620BLT-6I
HY57V561620BLT-KI
HY57V561620BLT-HI
HY57V561620BLT-8I
HY57V561620BLT-PI
HY57V561620BLT-SI
Clock Frequency
166MHz
133MHz
133MHz
125MHz
100MHz
100MHz
166MHz
133MHz
133MHz
125MHz
100MHz
100MHz
Power
Organization
Interface
Package
Normal
4Banks x 4Mbits x16
LVTTL
400mil 54pin TSOP II
Low power
This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev.1.3 / Apr. 2003
1

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Description 4 Banks x 4M x 16Bit Synchronous DRAM 4 Banks x 4M x 16Bit Synchronous DRAM 4 Banks x 4M x 16Bit Synchronous DRAM 4 Banks x 4M x 16Bit Synchronous DRAM

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