: Peak current for approximately 5% rolloff @ +25 °C
4. Part Number Definition: FPV1006-xxx-R
FPV1006 = Product code and size
xxx=Inductance value in nH,
-R suffix = RoHS compliant
Note: Hipot: 250 Vdc minimum for 2 seconds, conductor to core
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C
2. I
rms
: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating
conditions verified in the end application.
Dimensions (mm)
Recommended Pad Layout
Schematic
Part marking: FPV1006–xxx, xxx=inductance value in nH,
wwllyy= date code, R=revision level
Tolerances are ±0.25 unless stated otherwise
Soldering surfaces to be coplanar within 0.102 millimeters
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor.
Packaging information (mm)
Supplied in tape and reel packaging, 620 parts per 13” diameter reel
Direction of feed
2
www.eaton.com/electronics
FPV1006
High current power inductors
Inductance characteristics
Technical Data
10390
Effective September 2017
FPV1006-85-R
110%
100%
90%
80%
-40°C
110%
100%
90%
FPV1006-125-R
-40°C
% of OCL
70%
60%
50%
40%
30%
20%
0
20
40
60
80
+125°C
% of OCL
+25°C
80%
70%
60%
50%
40%
30%
+125°C
+25°C
100
120
140
20%
0
10
20
30
40
50
60
70
80
90
100
I
dc
(A)
I
dc
(A)
FPV1006-150-R
110%
100%
90%
-40°C
% of OCL
80%
70%
60%
50%
40%
30%
20%
0
10
20
30
40
50
60
+125°C
+25°C
70
80
I
dc
(A)
www.eaton.com/electronics
3
Technical Data
10390
Effective September 2017
FPV1006
High current power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton
also reserves the right to change or update, without notice, any technical information contained in this bulletin.
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