Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield™ Technology, High Voltage, X7R Dielectric,
500 – 1,000 VDC (Commercial & Automotive Grade)
Overview
The KEMET ArcShield high voltage surface mount capacitors in
X7R dielectric are designed for use in high voltage applications
susceptible to surface arcing (arc-over discharge).
The phenomenon of surface arcing is caused by a high voltage
gradient between the two termination surfaces or between one
of the termination surfaces and the counter internal electrode
structure within the ceramic body. It occurs most frequently at
application voltages that meet or exceed 300 V, in high humidity
environments, and in chip sizes with minimal bandwidth
separation (creepage distance). This phenomenon can either
damage surrounding components or lead to a breakdown of
the dielectric material, ultimately resulting in a short circuit
condition (catastrophic failure mode).
Patented ArcShield technology features KEMET's highly reliable
base metal dielectric system, combined with a unique internal
shield electrode structure that is designed to suppress an arc-
over event while increasing available capacitance. Developed
on the principle of a partial Faraday cage, this internal system
offers unrivaled performance and reliability when compared to
external surface coating technologies.
For added reliability, KEMET's flexible termination technology
is an available option that provides superior flex performance
over standard termination systems. This technology was
developed to address flex cracks, which are the primary failure
mode of MLCCs and typically the result of excessive tensile and
shear stresses produced during board flexure and thermal cycling.
Flexible termination technology inhibits the transfer of board
stress to the rigid body of the MLCC, therefore mitigating flex
cracks which can result in low IR or short circuit failures.
The KEMET ArcShield high voltage surface mount MLCCs are
available in automotive grade, which undergo stricter testing
protocol and inspection criteria. Whether underhood or in-cabin,
these devices are designed for mission and safety-critical
automotive circuits or applications requiring proven, reliable
performance in harsh environments. Automotive grade devices
meet the demanding Automotive Electronics Council's AEC-Q200
qualification requirements.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
0603
W
392
Capacitance
Code (pF)
K
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
C
Rated
Voltage
(VDC)
C = 500
B = 630
D = 1,000
R
Dielectric
R = X7R
A
Failure
Rate/
Design
A = N/A
C
Termination Finish
1
C = 100% Matte Sn
L = SnPb (5% PB minimum)
TU
Packaging/
Grade
(C-Spec)
2
See
"Packaging
C-Spec
Ordering
Options Table"
Case Size
Specification/
(L" x W")
Series
0603
0805
1206
1210
1808
1812
1825
2220
2225
V = ArcShield
Two significant
digits and
W = ArcShield
number of
with flexible
zeros.
termination
Additional termination finish options may be available. Contact KEMET for details.
SnPb termination finish option is not available on automotive grade product.
2
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1, 2
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 4/26/2018
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type
Commercial Grade
1
Bulk Bag
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Marked
13" Reel/Marked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch
2
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
1
1
Packaging/Grade
Ordering Code (C-Spec)
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
TM
7040 (EIA 0603 and smaller case sizes)
7215 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade
3
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3
Reeling tape options (paper or plastic) are dependent on capacitor case size (L x W) and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking."
Benefits
Patented technology
Permanent internal arc protection
Protective surface coating not required
Base metal electrode (BME) dielectric system
Industry leading CV values
−55°C to +125°C operating temperature range
Exceptional performance at high frequencies
Lead (Pb)-free, RoHS and REACH compliant
EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825,
2220, and 2225 case sizes
• DC voltage ratings of 500 V, 630 V and 1 KV
•
•
•
•
•
•
•
•
•
Capacitance offerings ranging from 1,000 pF to 560 nF
Available capacitance tolerances of ±5%, ±10% and ±20%
Low ESR and ESL
Non-polar device, minimizing installation concerns
Commercial and Automotive (AEC-Q200) grades available
100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb plated termination finish option available upon
request (5% Pb minimum)
• Flexible termination option available upon request
•
•
•
•
•
•
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 4/26/2018
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
KEMET assigned
1
AUTO
1
Customer Notification Due To:
Process/Product change
Yes (with approval and sign off)
Yes (without approval)
Obsolescence*
Yes
Yes
Days Prior To
Implementation
180 days minimum
90 days minimum
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive
C-Spec
KEMET assigned
1
AUTO
1
PPAP (Product Part Approval Process) Level
1
●
○
2
●
3
●
○
4
●
5
●
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
●
Part number specific PPAP available
○
Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 4/26/2018
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Applications
Typical applications include switch mode power supplies (input filters, resonators, tank circuits, snubber circuits, output
filters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling
capacitors in Ćuk converters. Markets include power supply, LCD fluorescent backlight ballasts, HID lighting, telecom
equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive
(electric and hybrid vehicles, charging stations and lighting) applications.
Application Notes
X7R dielectric is not recommended for AC line filtering or pulse applications.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 4/26/2018
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches) – Standard Termination
W
L
T
B
S
EIA Size
Code
0603
0805
1206
1210
1808
1812
1825
2220
2225
Metric Size
Code
1608
2012
3216
3225
4520
4532
4564
5650
5664
L
Length
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.70 (0.185)
±0.50 (0.020)
4.50 (0.177)
±0.30 (0.012)
4.50 (0.177)
±0.30 (0.012)
5.70 (0.224)
±0.40 (0.016)
5.60 (0.220)
±0.40 (0.016)
W
Width
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
T Thickness
B
Bandwidth
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
S
Separation
Minimum
0.70 (0.028)
0.75 (0.030)
Mounting
Technique
Solder Wave or
Solder Reflow
See Table 2 for
Thickness
N/A
Solder Reflow
Only
Dimensions – Millimeters (Inches) – Flexible Termination
EIA Size
Code
0603
0805
1206
1210
1808
1812
1825
2220
2225
Metric Size
Code
1608
2012
3216
3225
4520
4532
4564
5650
5664
L
Length
1.60 (0.064)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.70 (0.185)
±0.50 (0.020)
4.50 (0.178)
±0.40 (0.016)
4.60 (0.181)
±0.40 (0.016)
5.90 (0.232)
±0.75 (0.030)
5.90 (0.232)
±0.75 (0.030)
W
Width
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
T Thickness
B
Bandwidth
0.45 (0.018)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
S
Separation
Minimum
0.58 (0.023)
0.75 (0.030)
Mounting
Technique
Solder Wave or
Solder Reflow
See Table 2 for
Thickness
N/A
Solder Reflow
Only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 4/26/2018
5
RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
