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PCI2050BPDVG4

Description
PCI-to-PCI Bridge 208-LQFP 0 to 70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size447KB,88 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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PCI2050BPDVG4 Overview

PCI-to-PCI Bridge 208-LQFP 0 to 70

PCI2050BPDVG4 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeQFP
package instructionLFQFP, QFP208,1.2SQ,20
Contacts208
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time6 weeks
Address bus width32
Bus compatibilityPCI
maximum clock frequency66 MHz
External data bus width32
JESD-30 codeS-PQFP-G208
JESD-609 codee4
length28 mm
Humidity sensitivity level1
Number of terminals208
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP208,1.2SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply3.3,3.3/5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width28 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI

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Description PCI-to-PCI Bridge 208-LQFP 0 to 70 PCI-to-PCI Bridge 257-BGA MICROSTAR -40 to 85 PCI-to-PCI Bridge 257-BGA MICROSTAR -40 to 85 PCI-to-PCI Bridge 257-BGA MICROSTAR 0 to 70 PCI-to-PCI Bridge PCI-to-PCI Bridge 208-LQFP -40 to 85 PCI-to-PCI Bridge 257-BGA MICROSTAR 0 to 70 PCI-to-PCI Bridge 208-LQFP 0 to 70 PCI-to-PCI Bridge 208-LQFP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code QFP BGA BGA BGA QFP QFP BGA QFP QFP
package instruction LFQFP, QFP208,1.2SQ,20 LFBGA, BGA257,19X19,32 LFBGA, BGA257,19X19,32 LFBGA, BGA257,19X19,32 FQFP, QFP208,1.2SQ,20 LFQFP, QFP208,1.2SQ,20 LFBGA, BGA257,19X19,32 LFQFP, QFP208,1.2SQ,20 LFQFP, QFP208,1.2SQ,20
Contacts 208 257 257 257 208 208 257 208 208
Reach Compliance Code compli _compli compli _compli compli compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 3A001.A.3 EAR99 EAR99 EAR99 3A001.A.3
Factory Lead Time 6 weeks 6 weeks 1 week 1 week 1 week 6 weeks 1 week 1 week 6 weeks
Address bus width 32 32 32 32 32 32 32 32 32
Bus compatibility PCI PCI PCI PCI PCI PCI PCI PCI PCI
maximum clock frequency 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz
External data bus width 32 32 32 32 32 32 32 32 32
JESD-30 code S-PQFP-G208 S-PBGA-B257 S-PBGA-B257 S-PBGA-B257 S-PQFP-G208 S-PQFP-G208 S-PBGA-B257 S-PQFP-G208 S-PQFP-G208
JESD-609 code e4 e0 e1 e0 e4 e4 e1 e4 e4
length 28 mm 16 mm 16 mm 16 mm 28 mm 28 mm 16 mm 28 mm 28 mm
Humidity sensitivity level 1 3 3 3 4 1 3 1 1
Number of terminals 208 257 257 257 208 208 257 208 208
Maximum operating temperature 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFBGA LFBGA LFBGA FQFP LFQFP LFBGA LFQFP LFQFP
Encapsulate equivalent code QFP208,1.2SQ,20 BGA257,19X19,32 BGA257,19X19,32 BGA257,19X19,32 QFP208,1.2SQ,20 QFP208,1.2SQ,20 BGA257,19X19,32 QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 220 260 220 260 260 260 260 260
power supply 3.3,3.3/5 V 3.3,3.3/5 V 3.3,3.3/5 V 3.3,5 V 3.3,3.3/5 V 3.3,3.3/5 V 3.3,3.3/5 V 3.3,3.3/5 V 3.3,3.3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.4 mm 1.4 mm 1.4 mm 4.1 mm 1.6 mm 1.4 mm 1.6 mm 1.6 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING BALL BALL BALL GULL WING GULL WING BALL GULL WING GULL WING
Terminal pitch 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm
Terminal location QUAD BOTTOM BOTTOM BOTTOM QUAD QUAD BOTTOM QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 28 mm 16 mm 16 mm 16 mm 28 mm 28 mm 16 mm 28 mm 28 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Is it lead-free? Lead free - Lead free - - Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to - conform to - conform to conform to conform to conform to conform to
Base Number Matches - 1 1 1 - 1 1 1 -

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