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CR0402-J/-2R7GLF

Description
Thick Film Resistors - SMD 2.7OHM 1/16WATT 5%
CategoryPassive components   
File Size268KB,3 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
Download Datasheet Parametric View All

CR0402-J/-2R7GLF Overview

Thick Film Resistors - SMD 2.7OHM 1/16WATT 5%

CR0402-J/-2R7GLF Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerBourns
Product CategoryThick Film Resistors - SMD
RoHSDetails
Resistance2.7 Ohms
Power Rating62.5 mW (1/16 W)
Tolerance5 %
Temperature Coefficient- 250 PPM / C, + 500 PPM / C
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 125 C
Voltage Rating50 V
Case Code - in0402
Case Code - mm1005
PackagingCut Tape
PackagingMouseReel
PackagingReel
Height0.35 mm
Length1 mm
Package / Case0402 (1005 metric)
ProductThick Film Resistors SMD
TechnologyThick Film
Termination StyleSMD/SMT
TypeGeneral Purpose
Width0.5 mm
Mounting StylePCB Mount
Factory Pack Quantity10000
Unit Weight0.000023 oz
PL
IA
NT
Features
n
Small package dimensions
n
RoHS compliant*
n
Power rating at 70 °C = 1/16 W
n
Tight dimensional tolerances
n
Three layer termination process with
n
Suitable for most types of soldering
processes
n
Standard packaging on paper tape and reel
*R
oH
S
C
O
M
LE
AD
F
RE
E
nickel barrier prevents leaching and
provides excellent solderability
CR0402 - Chip Resistor
Derating Curve
100
Rated Power (%)
80
60
40
20
0
-55
0
70
155
Electrical Characteristics
Power Rating @ 70 °C ................1/16 W
Operating Temperature Range
................................-55 °C to +155 °C
Derated to 0 Load at ..................+155 °C
Maximum Working Voltage ..............50 V
Maximum Overload Voltage ..........100 V
Resistance Range
1 %, E-96
and E-24...... 10 ohms to 10 megohms
5 %, E-24 ........ 1 ohm to 20 megohms
Zero Ohm Jumper ............ <0.05 ohms
Temperature Coefficient
1 %
........10 Ω ≤ R ≤ 1 MΩ ±100 ppm/℃
5 %
......10 Ω ≤ R ≤ 10 MΩ ±200 ppm/℃
AEC-Q200 ..................... Contact Bourns
to confirm availability
10 MΩ < R ≤ 20 MΩ ±400 ppm/℃
1 Ω ≤ R < 10 Ω -200 to +500 ppm/°C
1 MΩ < R ≤ 10 MΩ ±200 ppm/℃
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Ambient Temperature (°C)
Standard Values
For Standard Values Used in Capac-
itors, Inductors, and Resistors,
click
here.
Part Marking System
No Marking on the CR0402 Chip
Resistors.
Dimensional Drawings
0.20 ± 0.10
(0.008 ± 0.004)
0.35 ± 0.05
(0.014 ± 0.002)
0.20 ± 0.10
(0.008 ± 0.004)
Resistor (Ru0
2
)
(Jumper chip is
a conductor)
Overcoat
0.25 ± 0.10
(0.010 ± 0.004)
0.25 ± 0.10
(0.010 ± 0.004)
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.05
(0.020 ± 0.002)
Alumina Substrate
DIMENSIONS:
MM
(INCHES)
Internal Electrode (Ag)
Secondary Electrode (Nickel Plated)
External Electrode
(tin-plated)
Performance Characteristics
Test
Thermal Shock
Short Time Overload
Resistance to Solder Heat
Resistance to Dry Heat
Load Life
Load Life with Humidity
Solderability
Bending
Dielectric Withstanding
Voltage
Insulation Resistance
Procedure
-55 ℃ for 30 minutes, +155 ℃ for 30 minutes,
5 cycles
2.5 X rated voltage for 5 seconds
270 ±5 ℃ for 10 ±1 seconds
125 ±5 ℃ for 96 ±4 hours
Rated voltage for 1000 hours, 70 ℃,
1.5 hours “ON“, 0.5 hours “OFF”
Rated voltage for 1000 hours, 40 ±2 ℃,
90~95 % RH, 1.5 hours “ON“, 0.5 hours “OFF”
245 ±5 ℃, 2 ±0.5 seconds
3 mm
--
100 V
Method
IEC60115-1-4.19
IEC60115-1-4.13
IEC60115-1-4.18
IEC60115-1-4.23.2
IEC60115-1-4.25.1
IEC60115-1-4.24
IEC60115-1-4.17
IEC60115-1-4.33
IEC60115-1-4.7
IEC60115-1-4.6
1%
Test Limits
DR
5%
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(2 % + 0.1 Ω)
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(2 % + 0.1 Ω)
≤±(3 % + 0.1 Ω)
≤±(3 % + 0.1 Ω)
≥95 % of area covered
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
>100 V
≥1 GΩ
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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