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IDT7188S45DB

Description
Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Categorystorage   
File Size69KB,7 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT7188S45DB Overview

Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22

IDT7188S45DB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeDIP
package instructionDIP, DIP22,.3
Contacts22
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Is SamacsysN
Base Number Matches1
CMOS STATIC RAM
64K (16K x 4-BIT)
Integrated Device Technology, Inc.
IDT7188S
IDT7188L
FEATURES:
• High-speed (equal access and cycle times)
— Military: 25/35/45/55/70/85ns (max.)
• Low power consumption
• Battery backup operation — 2V data retention (L version
only)
• Available in high-density industry standard 22-pin, 300
mil ceramic DIP
• Produced with advanced CMOS technology
• Inputs/outputs TTL-compatible
• Military product compliant to MIL-STD-883, Class B
DESCRIPTION:
The IDT7188 is a 65,536-bit high-speed static RAM
organized as 16K x 4. It is fabricated using IDT’s high-
performance, high-reliability technology — CMOS. This state-
of-the-art technology, combined with innovative circuit design
techniques, provides a cost effective approach for memory
intensive applications.
Access times as fast as 25ns are available. The IDT7188
offers a reduced power standby mode, I
SB1
, which is activated
when
CS
goes HIGH. This capability significantly decreases
power while enhancing system reliability. The low-power
version (L) version also offers a battery backup data retention
capability where the circuit typically consumes only 30µW
operating from a 2V battery.
All inputs and outputs are TTL-compatible and operate
from a single 5V supply. The IDT7188 is packaged in 22-pin,
300 mil ceramic DIP providing excellent board-level packing
densities.
Military grade product is manufactured in compliance with
the latest revision of MIL-STD-883, Class B, making it ideally
suited to military temperature applications demanding the
highest level of performance and reliability.
FUNCTIONAL BLOCK DIAGRAM
A
0
V
CC
GND
65,536-BIT
MEMORY ARRAY
DECODER
A
13
I/O
0
I/O
1
I/O
2
I/O
3
COLUMN I/O
INPUT
DATA
CONTROL
CS
WE
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
2989 drw 01
MILITARY TEMPERATURE RANGE
©1996
Integrated Device Technology, Inc.
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
AUGUST 1996
6.3
DSC-2989/7
1

IDT7188S45DB Related Products

IDT7188S45DB IDT7188L35DB IDT7188S70DB IDT7188S55DB IDT7188L55DB
Description Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP DIP DIP
package instruction DIP, DIP22,.3 0.300 INCH, CERAMIC, DIP-22 0.300 INCH, CERAMIC, DIP-22 DIP, DIP22,.3 DIP, DIP22,.3
Contacts 22 22 22 22 22
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
Base Number Matches 1 1 1 1 -
Maximum access time - 35 ns 70 ns 55 ns 55 ns
I/O type - COMMON COMMON COMMON COMMON
JESD-30 code - R-GDIP-T22 R-GDIP-T22 R-GDIP-T22 R-GDIP-T22
JESD-609 code - e0 e0 e0 e0
length - 27.051 mm 27.051 mm 27.051 mm 27.051 mm
memory density - 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width - 4 4 4 4
Number of functions - 1 1 1 1
Number of ports - 1 1 1 1
Number of terminals - 22 22 22 22
word count - 16384 words 16384 words 16384 words 16384 words
character code - 16000 16000 16000 16000
Operating mode - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -55 °C -55 °C -55 °C -55 °C
organize - 16KX4 16KX4 16KX4 16KX4
Output characteristics - 3-STATE 3-STATE 3-STATE 3-STATE
Exportable - NO NO NO NO
Package body material - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code - DIP DIP DIP DIP
Encapsulate equivalent code - DIP22,.3 DIP22,.3 DIP22,.3 DIP22,.3
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial - PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - 225 225 225 225
power supply - 5 V 5 V 5 V 5 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Filter level - MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
Maximum seat height - 5.08 mm 5.08 mm 5.08 mm 5.08 mm
Maximum standby current - 0.0006 A 0.02 A 0.02 A 0.0006 A
Minimum standby current - 2 V 4.5 V 4.5 V 2 V
Maximum slew rate - 0.115 mA 0.14 mA 0.14 mA 0.11 mA
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V
surface mount - NO NO NO NO
technology - CMOS CMOS CMOS CMOS
Temperature level - MILITARY MILITARY MILITARY MILITARY
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch - 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - 20 20 20 20
width - 7.62 mm 7.62 mm 7.62 mm 7.62 mm

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