EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AG-03-5602-D

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WBC-B0202AG-03-5602-D Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AG-03-5602-D - - View Buy Now

WBC-B0202AG-03-5602-D Overview

Resistor Networks & Arrays

WBC-B0202AG-03-5602-D Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
DIY open source Ethernet to serial port, RS485 transparent transmission.
[i=s] This post was last edited by sblpp on 2016-6-3 11:33 [/i] Use W5500+KL27 to realize Ethernet to serial RS232, RS485 and other solutions: (Low Cost!)The hardware is as follows:Schematic diagram:S...
sblpp DIY/Open Source Hardware
Six manufacturers won the bid for China Mobile's mobile phone customization
Six manufacturers won the bid for China Mobile's mobile phone customization, and domestic brands were absent again 2006-6-13On June 12, people familiar with the matter revealed that China Mobile has r...
ehk RF/Wirelessly
Please tell me how to open an external executable file under WinCE using VB.NET.
Please tell me how to open an external executable file under WinCE using VB.NET....
happyboy1986 Embedded System
Transferring files to ARM via serial port connection timeout
When transferring files to ARM via the serial port, a "connection timed out" error message appears. I am using the system's built-in hyperterminal. The ARM is a MINI2440 from Friendly Arm. What is goi...
chinaxu1986 ARM Technology
Is there something wrong with this circuit diagram of the common cathode RGB LED?
Is the direction of G+ in the last picture reversed?...
littleshrimp PCB Design
TI supports Bluetooth technology for high-precision body temperature measurement flexible PCB reference design
This reference design demonstrates the high-precision use of the TMP117 high-accuracy digital temperature sensor and the CC2640R2F wireless MCU. This user guide provides design guidance for skin tempe...
Jacktang Wireless Connectivity

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 906  273  919  1507  1766  19  6  31  36  57 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号