M
PL
IA
N
Features
■
0603 size
■
Available in E12 series
■
High Q - up to 80 typ.
■
High operating temperature of 125 °C
■
Small size of only 1.6 mm
■
RoHS compliant*
Applications
■
Mobile phones
■
Cellular phones
■
CTV, VCR, HIC, FDD
*R
oH
S
CO
T
CW160808 Series - High Q Chip Inductors
Electrical Specifications
Inductance
nH
CW160808-1N8M
CW160808-2N2D
CW160808-3N9J
CW160808-4N7J
CW160808-6N8J
CW160808-8N2J
CW160808-10NJ
CW160808-12NJ
CW160808-15NJ
CW160808-18NJ
CW160808-22NJ
CW160808-27NJ
CW160808-33NJ
CW160808-39NJ
CW160808-47NJ
CW160808-56NJ
CW160808-68NJ
CW160808-72NJ
CW160808-82NJ
CW160808-R10J
CW160808-R12J
CW160808-R15J
CW160808-R18J
CW160808-R22J
CW160808-R27J
1.8
2.2
3.9
4.7
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
72
82
100
120
150
180
220
270
Tol. %
±20
±15
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
Q
Min.
16
16
16
16
25
30
30
30
30
30
35
35
35
35
35
35
35
34
34
34
32
28
25
25
25
Test Freq.
(MHz)
L
250
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
200
150
150
150
150
100
100
100
Q
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
150
100
100
100
SRF
(MHz)
Min.
6000
6000
6000
5800
5800
5000
4800
4000
4000
3100
3000
2800
2300
2200
2100
1900
1700
1700
1700
1400
1350
1300
990
990
990
RDC
Ohms
0.04
0.08
0.08
0.10
0.11
0.11
0.13
0.13
0.17
0.17
0.19
0.22
0.22
0.25
0.28
0.31
0.34
0.49
0.54
0.71
0.79
0.92
1.25
1.90
2.30
I rms
(mA)
Max.
700
700
700
700
700
700
700
700
700
700
700
600
600
600
600
600
600
400
400
400
300
280
240
200
170
0.35
(.014)
Preheat
Area
150~200 °C / 60~120 Sec.
Reflow
Area
20~
40 °C/
Sec.
Max.
Forced Cooling
Area
-1~5 °C/Sec. Max.
PEAK TEMP.
260 °C
230 °C
-
50 SECONDS MAX.
General Specifications
Temperature Rise
.................20 °C max. at rated current
Operating Temperature
................................-40 °C to +125 °C
Storage Temperature
................................-40 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
.......................... +260 °C, 10 seconds
Materials
Core Material .............................Alumina
(1CC150707-302291)
Wire ........ Enameled copper (1W1E180)
Terminal ...........................Mo/Mn+Ni+Au
Encapsulate ......... Epoxy (1EAS-UV300)
Packaging ................. 3,000 pcs. per reel
Product Dimensions
0.35
(.014)
1.0
±
0.2
(.040
±
.008)
Bourns
®
Part No.
1.65
±
0.2
(.065
±
.008)
1.05
±
0.2
(.041
±
.008)
Solder Profile
Temperature
Rising
Area
-
0.35
(.014)
-
-
Recommended Layout
0.7
(.028)
0.7
REF.
(.028)
4 °C/
Sec.
Max.
REF.
250
Temperature (°C)
200
150
70 SECONDS MAX.
-
REF.
0.64
(.025)
1.2
REF.
(.047)
100
DIMENSIONS:
50
MM
(INCHES)
0
50
100
150
200
250
Time (Seconds)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CW160808 Series - High Q Chip Inductors
Packaging Specifications
2.0
±
0.5
(.079
±
.020)
178.0
(7.00)
DIA.
12.5
(.492)
21.0
±
0.8
(.827
±
.031)
13.0
±
0.5
(.512
±
.020)
DIA.
50.0
(1.969)
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
DIMENSIONS:
MM
(INCHES)
13.0
±
0.5
DIA.
(.512
±
.020)
EMBOSSED
CARRIER
10.0
(.393)
8.0
(.315)
REV. 02/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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