DCP69/-16/-25
20V PNP SURFACE MOUNT TRANSISTOR
Features
•
•
•
•
•
•
•
Epitaxial Planar Die Construction
Complementary NPN Type Available (DCP68)
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Totally Lead-Free & Fully RoHS compliant (Note 1)
Halogen and Antimony Free. “Green” Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
•
•
•
Case: SOT223
Case Material: Molded Plastic, "Green Molding” Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin
Solderable per MIL-STD -202, Method 208
Weight: 0.112 grams (approximate)
SOT223
C
B
E
Top View
Device Schematic
Top View
Pin Out Configuration
Ordering Information
(Note 3)
Part Number
DCP69-13
DCP69-16-13
DCP69-25-13
Notes:
Marking
P12
P12-16
P12-25
Reel size (inches)
13
13
13
Tape width (mm)
12
12
12
Quantity per reel
2500
2500
2500
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
YWW
xxx
xxx = Product Type Marking Code
P12 = DCP69
P12-16 = DCP69-16
P12-25 = DCP69-25
= Manufacturer’s code marking
YWW = Date Code Marking
Y = Last digit of year (ex: 1 = 2011)
WW = Week code (01 – 53)
DCP69/-16/-25
Document number: DS30798 Rev. 7 - 2
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April 2012
© Diodes Incorporated
DCP69/-16/-25
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Peak Pulse Current
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
Value
-25
-20
-5.0
-1.0
-2.0
Units
V
V
V
A
A
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient Air (Note 4)
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient Air (Note 5)
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
P
D
R
θ
JA
T
J
, T
STG
Value
1
125
2
62.5
-55 to +150
Unit
W
°C/W
W
°C/W
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 6)
Emitter-Base Breakdown Voltage
Collector-Base Cutoff Current
Emitter-Base Cutoff Current
ON CHARACTERISTICS (Note 6)
DCP69, DCP69-16, DCP69-25
DC Current Gain
DCP69
DCP69-16
DCP69-25
h
FE
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
EBO
Min
-25
-20
-5.0
—
—
50
60
85
100
160
—
—
40
—
Typ
—
—
—
—
—
—
—
—
—
—
—
—
200
17
Max
—
—
—
-100
-10
-100
—
—
375
250
375
-0.5
-0.7
-1.0
—
—
Unit
V
V
V
nA
μA
nA
Test Condition
I
C
= -100μA, I
E
= 0
I
C
= -10mA, I
B
= 0
I
E
= -100μA, I
C
= 0
V
CB
= -25V, I
E
= 0
V
CB
= -25V, I
E
= 0, T
A
= 150°C
V
EB
= -5.0V, I
C
= 0
V
CE
= -10V, I
C
= -5.0mA
V
CE
= -1.0V, I
C
= -1.0A
V
CE
= -1.0V, I
C
= -500mA
V
CE
= -1.0V, I
C
= -500mA
V
CE
= -1.0V, I
C
= -500mA
I
C
= -1.0A, I
B
= -100mA
V
CE
= -10V, I
C
= -5.0mA
V
CE
= -1.0V, I
C
= -1.0A
V
CE
= -5.0V, I
C
= -50mA, f = 100MHz
V
CB
= -10V, f = 1 MHz
—
Collector-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product
Output Capacitance
Notes:
V
CE(sat)
V
BE (on)
f
T
C
obo
V
V
MHz
pF
4. Device mounted on FR-4 PCB; pad layout as shown on in Diodes Inc. suggested pad layout document, which can be found on our website at
http://www.diodes.com
5. Device mounted on FR-4 PCB with 1in.
2
copper pad layout
6. Measured under pulsed conditions. Pulse width = 300μS. Duty cycle
≤
2%.
DCP69/-16/-25
Document number: DS30798 Rev. 7 - 2
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April 2012
© Diodes Incorporated
DCP69/-16/-25
2.0
1.8
1.6
P
D
, POWER DISSIPATION (mW)
1.6
-I
C
, COLLECTOR CURRENT (A)
1.4
1.2
1.0
I
B
= -10mA
I
B
= -8mA
1.2
I
B
= -6mA
0.8
0.6
0.4
I
B
= -2mA
I
B
= -4mA
0.8
0.4
0.2
0
0
25
50
150
100
125
75
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Dissipation vs. Ambient Temperature
0
0
1
2
3
4
5
6
7
8
9 10
-V
CE
, COLLECTOR EMITTER VOLTAGE (V)
Fig. 2 Typical Collector Current
vs. Collector-Emitter Voltage
350
-V
CE(SAT)
, COLLECTOR-EMITTER
SATURATION VOLTAGE (V)
0.6
V
CE
= -1V
T
A
= 150°C
I
C
/I
B
= 10
300
h
FE
, DC CURRENT GAIN
250
T
A
= 85°C
0.5
0.4
200
150
100
T
A
= -55°C
T
A
= 25°C
0.3
0.2
T
A
= 150°C
T
A
= 85°C
T
A
= 25°C
T
A
= -55°C
50
0
0.001
0.1
0
0.001
0.01
0.1
1
-I
C
, COLLECTOR CURRENT (A)
Fig. 3 Typical DC Current Gain
vs. Collector Current (DCP69-16)
10
0.01
0.1
1
10
-I
C
, COLLECTOR CURRENT (A)
Fig. 4 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
-V
BE(ON)
, BASE-EMITTER TURN-ON VOLTAGE (V)
1.2
1.0
-V
BE(SAT)
, BASE-EMITTER SATURATION VOLTAGE (V)
1.2
1.0
0.8
T
A
= -55°C
0.8
T
A
= -55°C
0.6
0.6
T
A
= 25°C
T
A
= 85°C
T
A
= 25°C
T
A
= 85°C
T
A
= 150°C
0.4
0.4
T
A
= 150°C
0.2
V
CE
= -1V
0.2
I
C
/I
B
= 10
0
0.001
0.01
0.1
1
-I
C
, COLLECTOR CURRENT (A)
Fig. 5 Typical Base-Emitter Turn-On Voltage
vs. Collector Current
10
0
0.001
0.01
0.1
1
10
-I
C
, COLLECTOR CURRENT (A)
Fig. 6 Typical Base-Emitter Saturation Voltage
vs. Collector Current
DCP69/-16/-25
Document number: DS30798 Rev. 7 - 2
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© Diodes Incorporated
DCP69/-16/-25
60
f
T
, CURRENT GAIN-BANDWIDTH PRODUCT (MHz)
250
f = 1MHz
200
CAPACITANCE (pF)
40
150
100
20
C
obo
50
V
CE
= -5V
f = 100MHz
0
0.01
0
0
0.1
1
10
100
V
R
, REVERSE VOLTAGE (V)
Fig. 7 Typical Output Capacitance Characteristics
20
40
60
80
100
-I
C
, COLLECTOR CURRENT (mA)
Fig. 8 Typical Gain-Bandwidth Product vs. Collector Current
Package Outline Dimensions
A
A1
SOT223
Dim Min Max Typ
A
1.55 1.65 1.60
A1
0.010 0.15 0.05
b1
2.90 3.10 3.00
b2
0.60 0.80 0.70
C
0.20 0.30 0.25
D
6.45 6.55 6.50
E
3.45 3.55 3.50
E1
6.90 7.10 7.00
e
—
—
4.60
e1
—
—
2.30
L
0.85 1.05 0.95
Q
0.84 0.94 0.89
All Dimensions in mm
Suggested Pad Layout
X1
Y1
C1
Y2
C2
X2
Dimensions
X1
X2
Y1
Y2
C1
C2
Value (in mm)
3.3
1.2
1.6
1.6
6.4
2.3
DCP69/-16/-25
Document number: DS30798 Rev. 7 - 2
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© Diodes Incorporated
DCP69/-16/-25
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
DCP69/-16/-25
Document number: DS30798 Rev. 7 - 2
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April 2012
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