MC33663ALEFR2 datasheet, PDF - EEWORLD Datasheet

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MC33663ALEFR2: DescriptionLIN Transceivers dual LINcell; CategoryWireless rf/communication Telecom circuit; File Size624KB，37 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC33663ALEFR2 Overview

LIN Transceivers dual LINcell

MC33663ALEFR2 Parametric

Parameter Name	Attribute value
Brand Name	Freescale
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
package instruction	1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	R-PDSO-G14
JESD-609 code	e3
length	8.65 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1.75 mm
Nominal supply voltage	13.5 V
surface mount	YES
Telecom integrated circuit types	INTERFACE CIRCUIT
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	3.9 mm
Base Number Matches	1

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Freescale Semiconductor

Advance Information

Document Number: MC33663

Rev. 2.0, 12/2013

LIN 2.1 / SAEJ2602-2 Dual LIN

Physical Layer

The local interconnect network (LIN) is a serial communication

protocol designed to support automotive networks in conjunction with

controller area network (CAN). As the lowest level of a hierarchical

network, LIN enables cost-effective communication with sensors and

actuators when all the features of CAN are not required.

The 33663 product line integrates two physical layer LIN bus

dedicated to automotive LIN sub-bus applications. The MC33663LEF

and MC33663SEF devices offer normal baud rate (20 kbps) and the

MC33663JEF slow baud rate (10 kbps). Both devices integrate fast

baud rate (above 100 kbps) for test and programming modes. They

present excellent electromagnetic compatibility (EMC) and radiated

emission performance, electrostatic discharge (ESD) robustness and

safe behavior, in the event of LIN bus short-to-ground or LIN bus

leakage during low-power mode.

Features

33663

DUAL LIN TRANSCEIVER

EF SUFFIX (PB-FREE)

98ASB42565B

14-PIN SOICN

ORDERING INFORMATION

Temperature

Range (T

)

Package

• Operational from V

SUP

7.0 to 18 V DC, functional up to 27 V DC,

Device

and handles 40 V during load dump

(add an R2 suffix for

• Compatible with LIN protocol specification 2.1, and SAEJ2602-2

Tape and reel orders)

• Very high immunity against electromagnetic interference

MC33663ALEF

• Low standby current in Sleep mode

MC33663AJEF

• Over-temperature protection

• Permanent dominant state detection

MC33663ASEF

• Fast baud rate mode selection reported by RXD

• Active bus waveshaping offering excellent radiated emission

performance

• Sustains

15.0 kV ESD IEC6100-4-2 on LIN BUS and VSUP pins

• 5.0 and 3.3 V compatible digital inputs without any external components required

BAT

- 40 to 125°C

14 SOICN

33663

VSUP

WAKE1

WAKE2

INH1

INH2

1.0 k

LIN1

GND LIN2

1.0 k

LIN Interface 1

LIN Interface 2

Regulator

12 V

5.0 or

3.3 V

MCU

VDD

EN1

RXD1

TXD1

EN2

RXD2

TXD2

Figure 1. 33663 Simplified Application Diagram

* This document contains certain information on a new product.

Specifications and information herein are subject to change without notice.

MC33663ALEFR2 Related Products

	MC33663ALEFR2	MC33663AJEFR2	MC33663ASEFR2	MC33663ASEF	MC33663ALEF	KIT33663LEFEVB
Description	LIN Transceivers dual LINcell	LIN Transceivers dual LINcell	LIN Transceivers dual LINcell	LIN Transceivers dual LINcell	LIN Transceivers dual LINcell	Interface Development Tools SAEJ2602-2 Dual LIN Physical Layer
Brand Name	Freescale	Freescale	Freescale	Freescale	Freescale	-
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-
Maker	NXP	NXP	NXP	NXP	NXP	-
package instruction	1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14	1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14	1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14	1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14	1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14	-
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	-
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	-
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	-
JESD-609 code	e3	e3	e3	e3	e3	-
length	8.65 mm	8.65 mm	8.65 mm	8.65 mm	8.65 mm	-
Humidity sensitivity level	3	3	3	3	3	-
Number of functions	1	1	1	1	1	-
Number of terminals	14	14	14	14	14	-
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	SOP	SOP	SOP	SOP	SOP	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-
Peak Reflow Temperature (Celsius)	260	260	260	260	260	-
Maximum seat height	1.75 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm	-
Nominal supply voltage	13.5 V	13.5 V	13.5 V	13.5 V	13.5 V	-
surface mount	YES	YES	YES	YES	YES	-
Telecom integrated circuit types	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	-
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	40	40	40	40	40	-
width	3.9 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm	-
Base Number Matches	1	1	1	1	1	-

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