Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) .....18.46°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ............1.82°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
Very cool, it solves the problem of insufficient IO ports on LaunchPad, very valuable~~~The development board I use is g2553~~~[[i]This post was last edited by 574937246 on 2012-7-20 14:46[/i]]...
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