Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) .....18.46°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ............1.82°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
Edge detection is the preparatory work for feature recognition. In fact, the typical image processing process needs to mark the connected domain before edge detection, obtain a certain figure on the i...
I have the following questions about TI's SPRZ295J document (TMS320F2803x Piccolo MCU Silicon Errata):1. If SOC0~3 are configured as "simultaneous sampling", that is, SOC0 and SOC1 are a pair, and SOC...
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[align=left][font=宋体]The full-time positions currently available in the company are as follows, and the educational requirement is college degree or above. Interested students are welcome to send thei...
Prepare the MaterialsCCS6
Download address: http://www.ti.com/tool/ccstudioF2812 C language header file
Download address: http://www.ti.com/lit/zip/sprc097
The file structure after installation is as ...
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