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89HPES24N3YDBXG

Description
PCI Interface IC PCIE 24-LANE 3-PORT NTS
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size262KB,30 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES24N3YDBXG Overview

PCI Interface IC PCIE 24-LANE 3-PORT NTS

89HPES24N3YDBXG Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeSBGA
package instruction27 X 27 MM, 1 MM PITCH, GREEN, BGA-420
Contacts420
Manufacturer packaging codeBXG420
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresALSO REQUIRES 3.3V SUPPLY
maximum clock frequency125 MHz
JESD-30 codeS-PBGA-B420
JESD-609 codee1
length27 mm
Humidity sensitivity level3
Number of terminals420
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA420,26X26,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width27 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
24-Lane 3-Port PCI Express®
Switch
89HPES24N3
Data Sheet
Device Overview
The 89HPES24N3 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions offering the next-generation I/O intercon-
nect standard. The PES24N3 is a 24-lane, 3-port peripheral chip that
performs PCI Express Base switching with a feature set optimized for
high performance applications such as servers, storage, and communi-
cations/networking. It provides high-performance I/O connectivity and
switching functions between a PCIe® upstream port and two down-
stream ports or peer-to-peer switching between downstream ports.
Features
High Performance PCI Express Switch
– 24 PCI Express lanes (2.5Gbps), 3 switch ports
– Delivers 12 GBps (96 Gbps) aggregate switching capacity
– Low latency cut-through switch architecture
– Supports 128 to 2048 byte maximum payload size
– Supports one virtual channel
– PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
– Port arbitration schemes utilizing round robin or weighted
round robin algorithms
– Supports automatic per port link with negotiation (x8, x4, x2, or
x1)
– Supports static lane reversal on all ports
– Supports polarity inversion
– Supports locked transactions, allowing use with legacy soft-
ware
– Ability to load device configuration from serial EEPROM
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates 24 2.5 Gbps embedded SerDes, 8B/10B encoder/
decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC passed through
– Supports PCI Express Native Hot-Plug
• Compatible with Hot-Plug I/O expanders used on PC moth-
erboards
– Supports Hot-Swap
Power Management
– Supports PCI Express Power Management Interface specifi-
cation, Revision 1.1 (PCI-PM)
– Unused SerDes are disabled
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in SerDes Pseudo-Random Bit Stream (PRBS) generator
– Ability to read and write any internal register via the SMBus
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
24 PCI Express Lanes
x8 Upstream Port and Two x8 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
1 of 30
©
2006 Integrated Device Technology, Inc.
July 18, 2006
DSC 6802

89HPES24N3YDBXG Related Products

89HPES24N3YDBXG 89HPES24N3YDBX 89HPES24N3YCBX 89HPES24N3YCBXG
Description PCI Interface IC PCIE 24-LANE 3-PORT NTS PCI Interface IC PCIE 24-LANE 3-PORT NTS PCI Interface IC PCIE 24-LANE 3-PORT NTS PCI Interface IC PCIE 24-LANE 3-PORT NTS
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Contains lead Contains lead Lead free
Is it Rohs certified? conform to incompatible incompatible conform to
Parts packaging code SBGA SBGA SBGA SBGA
package instruction 27 X 27 MM, 1 MM PITCH, GREEN, BGA-420 27 X 27 MM, 1 MM PITCH, BGA-420 BGA-420 BGA-420
Contacts 420 420 420 420
Manufacturer packaging code BXG420 BX420 BX420 BXG420
Reach Compliance Code compliant not_compliant not_compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B420 S-PBGA-B420 S-PBGA-B420 S-PBGA-B420
JESD-609 code e1 e0 e0 e1
length 27 mm 27 mm 27 mm 27 mm
Humidity sensitivity level 3 3 3 3
Number of terminals 420 420 420 420
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Encapsulate equivalent code BGA420,26X26,40 BGA420,26X26,40 BGA420,26X26,40 BGA420,26X26,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 225 225 260
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.7 mm 1.7 mm 1.7 mm 1.7 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 20 20 30
width 27 mm 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
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