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82V2108BB

Description
Telecom Interface ICs
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,292 Pages
ManufacturerIDT (Integrated Device Technology)
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82V2108BB Overview

Telecom Interface ICs

82V2108BB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionPLASTIC, BGA-144
Contacts144
Reach Compliance Codenot_compliant
ECCN codeEAR99
Is SamacsysN
JESD-30 codeS-PBGA-B144
JESD-609 codee0
length13 mm
Humidity sensitivity level3
Number of functions1
Number of terminals144
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.97 mm
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width13 mm
Base Number Matches1
T1 / E1 / J1 Octal Framer
IDT82V2108
Version 5
November 26, 2012
2975 Stender Way, Santa Clara, Califormia 95054
Telephone: (800) 345-7015 • TWX: 910-338-2070 • FAX: (408) 492-8674
Printed in U.S.A.
© 2011 Integrated Device Technology, Inc.

82V2108BB Related Products

82V2108BB 82V2108PXG8 82V2108PX8
Description Telecom Interface ICs Telecom Interface ICs 3.3V FRAMER Telecom Interface ICs 3.3V FRAMER
Is it lead-free? Contains lead Lead free Contains lead
Is it Rohs certified? incompatible conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA QFP QFP
package instruction PLASTIC, BGA-144 PLASTIC, QFP-128 PLASTIC, QFP-128
Contacts 144 128 128
Reach Compliance Code not_compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99
Is Samacsys N N N
JESD-30 code S-PBGA-B144 R-PQFP-G128 R-PQFP-G128
JESD-609 code e0 e3 e0
length 13 mm 20 mm 20 mm
Number of functions 1 1 1
Number of terminals 144 128 128
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA FQFP FQFP
Encapsulate equivalent code BGA144,12X12,40 QFP128,.67X.93,20 QFP128,.67X.93,20
Package shape SQUARE RECTANGULAR RECTANGULAR
Package form GRID ARRAY FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius) 225 260 225
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.97 mm 3.4 mm 3.4 mm
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Telecom integrated circuit types FRAMER FRAMER FRAMER
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn63Pb37) MATTE TIN Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING GULL WING
Terminal pitch 1 mm 0.5 mm 0.5 mm
Terminal location BOTTOM QUAD QUAD
Maximum time at peak reflow temperature 20 30 20
width 13 mm 14 mm 14 mm
Base Number Matches 1 1 1
Humidity sensitivity level 3 - 3
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