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82V2108PX8

Description
Telecom Interface ICs 3.3V FRAMER
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,292 Pages
ManufacturerIDT (Integrated Device Technology)
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82V2108PX8 Overview

Telecom Interface ICs 3.3V FRAMER

82V2108PX8 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionPLASTIC, QFP-128
Contacts128
Reach Compliance Codenot_compliant
ECCN codeEAR99
Is SamacsysN
JESD-30 codeR-PQFP-G128
JESD-609 codee0
length20 mm
Humidity sensitivity level3
Number of functions1
Number of terminals128
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFQFP
Encapsulate equivalent codeQFP128,.67X.93,20
Package shapeRECTANGULAR
Package formFLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.4 mm
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
Base Number Matches1
T1 / E1 / J1 Octal Framer
IDT82V2108
Version 5
November 26, 2012
2975 Stender Way, Santa Clara, Califormia 95054
Telephone: (800) 345-7015 • TWX: 910-338-2070 • FAX: (408) 492-8674
Printed in U.S.A.
© 2011 Integrated Device Technology, Inc.

82V2108PX8 Related Products

82V2108PX8 82V2108PXG8 82V2108BB
Description Telecom Interface ICs 3.3V FRAMER Telecom Interface ICs 3.3V FRAMER Telecom Interface ICs
Is it lead-free? Contains lead Lead free Contains lead
Is it Rohs certified? incompatible conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP QFP BGA
package instruction PLASTIC, QFP-128 PLASTIC, QFP-128 PLASTIC, BGA-144
Contacts 128 128 144
Reach Compliance Code not_compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99
Is Samacsys N N N
JESD-30 code R-PQFP-G128 R-PQFP-G128 S-PBGA-B144
JESD-609 code e0 e3 e0
length 20 mm 20 mm 13 mm
Number of functions 1 1 1
Number of terminals 128 128 144
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FQFP FQFP BGA
Encapsulate equivalent code QFP128,.67X.93,20 QFP128,.67X.93,20 BGA144,12X12,40
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form FLATPACK, FINE PITCH FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Celsius) 225 260 225
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 3.4 mm 3.4 mm 1.97 mm
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Telecom integrated circuit types FRAMER FRAMER FRAMER
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) MATTE TIN Tin/Lead (Sn63Pb37)
Terminal form GULL WING GULL WING BALL
Terminal pitch 0.5 mm 0.5 mm 1 mm
Terminal location QUAD QUAD BOTTOM
Maximum time at peak reflow temperature 20 30 20
width 14 mm 14 mm 13 mm
Base Number Matches 1 1 1
Humidity sensitivity level 3 - 3
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