ZSSC3036Cl1B datasheet, PDF - EEWORLD Datasheet

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ZSSC3036Cl1B: DescriptionSensor Interface die (tested to -40 to +85C); Categorysemiconductor Analog mixed-signal IC; File Size1MB，49 Pages; ManufacturerIDT (Integrated Device Technology)

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Sensor Interface die (tested to -40 to +85C)

ZSSC3036Cl1B Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	IDT (Integrated Device Technology)
Product Category	Sensor Interface
Package / Case	DIE

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Data Sheet

Rev. 2.01 / August 2014

ZSSC3036

Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner

Mobile Sensing ICs

Smart and Mobile

ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

Table of Contents

IC Characteristics .......................................................................................................................................... 7

1.1.

1.2.

1.3.

1.4.

2.1.

2.2.

2.3.

Absolute Maximum Ratings .................................................................................................................... 7

Operating Conditions .............................................................................................................................. 7

Electrical Parameters ............................................................................................................................. 8

Power Supply Rejection Ratio (RSRR) vs. Frequency......................................................................... 10

Brief Description ................................................................................................................................... 11

Signal Flow and Block Diagram............................................................................................................ 11

Analog Front End .................................................................................................................................. 12

Amplifier ......................................................................................................................................... 12

Analog-to-Digital Converter ............................................................................................................ 14

Temperature Measurement ........................................................................................................... 18

Bridge Supply ................................................................................................................................. 18

Digital Signal Processor (DSP) Core ............................................................................................. 18

MTP Memory.................................................................................................................................. 18

Clock Generator ............................................................................................................................. 19

Power Supervision ......................................................................................................................... 19

Interface ......................................................................................................................................... 19

Circuit Description ....................................................................................................................................... 11

2.3.1.

2.3.2.

2.3.3.

2.3.4.

2.4.

2.4.1.

2.4.2.

2.4.3.

2.4.4.

2.4.5.

3.1.

3.2.

3.3.

3.4.

3.5.

Digital Section ....................................................................................................................................... 18

Functional Description ................................................................................................................................. 20

Power Up .............................................................................................................................................. 20

Measurements ...................................................................................................................................... 20

Operational Modes ............................................................................................................................... 21

Command Interpretation ....................................................................................................................... 23

SPI/I C™ Commands .................................................................................................................... 23

Common Functionality ................................................................................................................... 26

SPI ................................................................................................................................................. 27

I C™ ............................................................................................................................................... 30

Programming Memory ................................................................................................................... 31

Memory Status Commands ........................................................................................................... 32

Memory Contents ........................................................................................................................... 33

3.4.1.

3.5.1.

3.5.2.

3.5.3.

3.6.

3.6.1.

3.6.2.

3.6.3.

Communication Interface ...................................................................................................................... 26

Memory ................................................................................................................................................. 31

Data Sheet

August 24, 2014

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

4 of 49

ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

3.7.

Calibration Sequence ........................................................................................................................... 39

Calibration Step 1 – Assigning Unique Identification ..................................................................... 40

Calibration Step 2 – Data Collection .............................................................................................. 40

Calibration Step 3 – Coefficient Calculations ................................................................................. 41

Bridge Signal Compensation ......................................................................................................... 41

Temperature Signal Compensation ............................................................................................... 44

3.7.1.

3.7.2.

3.7.3.

3.8.

3.8.1.

3.8.2.

The Calibration Math ............................................................................................................................ 41

Die Pad Assignments .................................................................................................................................. 45

Quality and Reliability .................................................................................................................................. 46

Ordering Sales Codes ................................................................................................................................. 46

Related Documents ..................................................................................................................................... 47

Glossary ...................................................................................................................................................... 47

Document Revision History ......................................................................................................................... 49

Table of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

ZSSC3036 Functional Block Diagram ........................................................................................... 11

ADC Offset ..................................................................................................................................... 17

Operational Flow Chart: Power Up ................................................................................................ 22

Operational Flow Chart: Command Mode and Normal Mode ....................................................... 23

SPI Configuration CPHA=0 ........................................................................................................... 27

SPI Configuration CPHA=1 ........................................................................................................... 28

SPI Command Request ................................................................................................................. 28

SPI Read Status ............................................................................................................................ 29

SPI Read Data ............................................................................................................................... 29

C™ Command Request .............................................................................................................. 30

I C™ Read Status .......................................................................................................................... 30

Figure 3.10 I C™ Read Data ............................................................................................................................ 31

Figure 3.11 Memory Program Operation .......................................................................................................... 32

Figure 4.1

ZSSC3036 Pad Assignments ........................................................................................................ 45

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Data Sheet

August 24, 2014

Maximum Ratings ............................................................................................................................ 7

Operating Conditions ....................................................................................................................... 7

Requirements for VDD Power-on Reset .......................................................................................... 8

Electrical Parameters ....................................................................................................................... 8

Amplifier Gain: Stage 1 .................................................................................................................. 12

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

5 of 49

ZSSC3036Cl1B Related Products

	ZSSC3036Cl1B	ZSSC3036Cl6B	ZSSC3036Cl1C
Description	Sensor Interface die (tested to -40 to +85C)	Sensor Interface die (tested to -40 to +85C)725 m	Sensor Interface Die on frame (tested to -40 to +85C)
Product Attribute	Attribute Value	Attribute Value	Attribute Value
Manufacturer	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Product Category	Sensor Interface	Sensor Interface	Sensor Interface
Package / Case	DIE	DIE	DIE

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