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74AUP2G34GXZ

Description
Buffers & Line Drivers 74AUP2G34GX/X2SON6/REEL 7" Q2/
Categorysemiconductor    logic   
File Size823KB,20 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AUP2G34GXZ Overview

Buffers & Line Drivers 74AUP2G34GX/X2SON6/REEL 7" Q2/

74AUP2G34GXZ Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerNXP
Product CategoryBuffers & Line Drivers
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseX2SON-6
PackagingReel
Factory Pack Quantity10000
74AUP2G34
Low-power dual buffer
Rev. 6 — 17 September 2015
Product data sheet
1. General description
The 74AUP2G34 provides two low-power, low-voltage buffers.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
A
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial Power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

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Description Buffers & Line Drivers 74AUP2G34GX/X2SON6/REEL 7" Q2/ Buffers & Line Drivers DUAL BUFFER 1.8V Buffers & Line Drivers 1.8V DUAL BUF GATE
Brand Name - NXP Semiconductor NXP Semiconductor
Is it Rohs certified? - conform to conform to
Maker - NXP NXP
Parts packaging code - TSSOP SON
package instruction - TSSOP, TSSOP6,.08 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Contacts - 6 6
Manufacturer packaging code - SOT363 SOT886
Reach Compliance Code - compliant compliant
series - AUP/ULP/V AUP/ULP/V
JESD-30 code - R-PDSO-G6 R-PDSO-N6
JESD-609 code - e3 e3
length - 2 mm 1.45 mm
Load capacitance (CL) - 30 pF 30 pF
Logic integrated circuit type - BUFFER BUFFER
MaximumI(ol) - 0.0017 A 0.0017 A
Humidity sensitivity level - 1 1
Number of functions - 1 1
Number of entries - 1 1
Number of terminals - 6 6
Maximum operating temperature - 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - TSSOP VSON
Encapsulate equivalent code - TSSOP6,.08 SOLCC6,.04,20
Package shape - RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) - 260 260
power supply - 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Sup - 20.8 ns 20.8 ns
propagation delay (tpd) - 20.8 ns 20.8 ns
Certification status - Not Qualified Not Qualified
Schmitt trigger - NO NO
Maximum seat height - 1.1 mm 0.5 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 0.8 V 0.8 V
surface mount - YES YES
technology - CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE
Terminal surface - Tin (Sn) Tin (Sn)
Terminal form - GULL WING NO LEAD
Terminal pitch - 0.65 mm 0.5 mm
Terminal location - DUAL DUAL
Maximum time at peak reflow temperature - 30 30
width - 1.25 mm 1 mm
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