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74AUP2G34GM,115

Description
Buffers & Line Drivers 1.8V DUAL BUF GATE
Categorylogic    logic   
File Size823KB,20 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AUP2G34GM,115 Overview

Buffers & Line Drivers 1.8V DUAL BUF GATE

74AUP2G34GM,115 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSON
package instruction1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Contacts6
Manufacturer packaging codeSOT886
Reach Compliance Codecompliant
seriesAUP/ULP/V
JESD-30 codeR-PDSO-N6
JESD-609 codee3
length1.45 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.0017 A
Humidity sensitivity level1
Number of functions1
Number of entries1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSON
Encapsulate equivalent codeSOLCC6,.04,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Prop。Delay @ Nom-Sup20.8 ns
propagation delay (tpd)20.8 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width1 mm
74AUP2G34
Low-power dual buffer
Rev. 6 — 17 September 2015
Product data sheet
1. General description
The 74AUP2G34 provides two low-power, low-voltage buffers.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
A
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial Power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

74AUP2G34GM,115 Related Products

74AUP2G34GM,115 74AUP2G34GW,125 74AUP2G34GXZ
Description Buffers & Line Drivers 1.8V DUAL BUF GATE Buffers & Line Drivers DUAL BUFFER 1.8V Buffers & Line Drivers 74AUP2G34GX/X2SON6/REEL 7" Q2/
Brand Name NXP Semiconductor NXP Semiconductor -
Is it Rohs certified? conform to conform to -
Maker NXP NXP -
Parts packaging code SON TSSOP -
package instruction 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 TSSOP, TSSOP6,.08 -
Contacts 6 6 -
Manufacturer packaging code SOT886 SOT363 -
Reach Compliance Code compliant compliant -
series AUP/ULP/V AUP/ULP/V -
JESD-30 code R-PDSO-N6 R-PDSO-G6 -
JESD-609 code e3 e3 -
length 1.45 mm 2 mm -
Load capacitance (CL) 30 pF 30 pF -
Logic integrated circuit type BUFFER BUFFER -
MaximumI(ol) 0.0017 A 0.0017 A -
Humidity sensitivity level 1 1 -
Number of functions 1 1 -
Number of entries 1 1 -
Number of terminals 6 6 -
Maximum operating temperature 125 °C 125 °C -
Minimum operating temperature -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code VSON TSSOP -
Encapsulate equivalent code SOLCC6,.04,20 TSSOP6,.08 -
Package shape RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -
Peak Reflow Temperature (Celsius) 260 260 -
power supply 1.2/3.3 V 1.2/3.3 V -
Prop。Delay @ Nom-Sup 20.8 ns 20.8 ns -
propagation delay (tpd) 20.8 ns 20.8 ns -
Certification status Not Qualified Not Qualified -
Schmitt trigger NO NO -
Maximum seat height 0.5 mm 1.1 mm -
Maximum supply voltage (Vsup) 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 0.8 V 0.8 V -
surface mount YES YES -
technology CMOS CMOS -
Temperature level AUTOMOTIVE AUTOMOTIVE -
Terminal surface Tin (Sn) Tin (Sn) -
Terminal form NO LEAD GULL WING -
Terminal pitch 0.5 mm 0.65 mm -
Terminal location DUAL DUAL -
Maximum time at peak reflow temperature 30 30 -
width 1 mm 1.25 mm -

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