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AM29C818A

Description
CMOS PIPELINE REGISTER WITH SSR DIAGNOSTICS
File Size861KB,21 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM29C818A Overview

CMOS PIPELINE REGISTER WITH SSR DIAGNOSTICS

AM29C818A Related Products

AM29C818A AM29C818AJC AM29C818APC AM29C818ASC
Description CMOS PIPELINE REGISTER WITH SSR DIAGNOSTICS CMOS PIPELINE REGISTER WITH SSR DIAGNOSTICS CMOS PIPELINE REGISTER WITH SSR DIAGNOSTICS CMOS PIPELINE REGISTER WITH SSR DIAGNOSTICS
Is it lead-free? - Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible
Parts packaging code - QLCC DIP SOIC
package instruction - QCCJ, DIP, SOP,
Contacts - 28 24 24
Reach Compliance Code - unknow unknow unknow
Other features - DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL & PARALLEL DATA I/P\'S DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL & PARALLEL DATA I/P'S DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL & PARALLEL DATA I/P'S
series - CMOS CMOS CMOS
JESD-30 code - S-PQCC-J28 R-PDIP-T24 R-PDSO-G24
JESD-609 code - e0 e0 e0
length - 11.5062 mm 30.734 mm 15.4 mm
Load capacitance (CL) - 50 pF 50 pF 50 pF
Logic integrated circuit type - BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits - 8 8 8
Number of functions - 1 1 1
Number of ports - 2 2 2
Number of terminals - 28 24 24
Maximum operating temperature - 70 °C 70 °C 70 °C
Output characteristics - 3-STATE 3-STATE 3-STATE
Output polarity - TRUE TRUE TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - QCCJ DIP SOP
Package shape - SQUARE RECTANGULAR RECTANGULAR
Package form - CHIP CARRIER IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) - 12 ns 12 ns 12 ns
Certification status - Not Qualified Not Qualified Not Qualified
Maximum seat height - 4.57 mm 5.08 mm 3 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V
surface mount - YES NO YES
technology - CMOS CMOS CMOS
Temperature level - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - J BEND THROUGH-HOLE GULL WING
Terminal pitch - 1.27 mm 2.54 mm 1.27 mm
Terminal location - QUAD DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 11.5062 mm 7.62 mm 7.5 mm
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