SKa 1
Fig. 5 Forward characteristics
Fig. 8 Overload current vs. time
Fig. 9 Reverse power dissipation vs. time
Fig. 12 Forward current vs. reference temperature
Fig. 13 Reverse current vs. junction temperature
Fig. 14 Thermal resistance vs. lead length
2
02-04-2004 SCT
© by SEMIKRON
SKa 1
Dimensions in mm
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee
expressed or implied is made regarding delivery, performance or suitability.
3
02-04-2004 SCT
© by SEMIKRON