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BR25L010F-WE2

Description
EEPROM SPI 1K BIT
Categorystorage    storage   
File Size732KB,20 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BR25L010F-WE2 Overview

EEPROM SPI 1K BIT

BR25L010F-WE2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerROHM Semiconductor
Parts packaging codeSOIC
package instructionLSOP, SOP8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)5 MHz
Data retention time - minimum40
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee2
length5 mm
memory density1024 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count128 words
character code128
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128X8
Package body materialPLASTIC/EPOXY
encapsulated codeLSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2/5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Serial bus typeSPI
Maximum standby current0.000002 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width4.4 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
High Reliability Serial EEPROMs
SPI BUS Serial EEPROMs
BR25□□□□family
BR25L010-W series, BR25L020-W series, BR25L040-W series, BR25L080-W series,
BR25L160-W series, BR25L320-W series, BR25L640-W series
Description
BR25L
-W series is a serial EEPROM of SPI BUS interface method.
Features
·
·
·
·
·
·
·
·
·
Page write
·
·
Number of
pages
16 Byte
BR25L010-W
32 Byte
BR25L080-W
BR25L160-W
BR25L320-W
BR25L640-W
Product
number
BR25L020-W
BR25L040-W
·
·
·
·
*1 BR25L080/160-W : SOP8, SOP-J8, SSOP-B8, TSSOP-B8
*2 BR25L320/640-W : SOP8, SOP-J8
BR25L series
Capacity
1Kbit
2Kbit
4Kbit
8Kbit
16Kbit
32Kbit
64Kbit
Bit format
128 X 8
256 X 8
512 X 8
1K X 8
2K X 8
4K X 8
8K X 8
Type
BR25L010-W
BR25L020-W
BR25L040-W
BR25L080-W
BR25L160-W
BR25L320-W
BR25L640-W
Power source
voltage
SOP8
F
SOP-J8
FJ
SSOP-B8
FV
TSSOP-B8
FVT
MSOP8
FVM
TSSOP-B8J
FVJ
1.8 ~ 5.5V
1.8 ~ 5.5V
1.8 ~ 5.5V
1.8 ~ 5.5V
1.8 ~ 5.5V
1.8 ~ 5.5V
1.8 ~ 5.5V
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
1/16
2010.07 -
Rev. B

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Description EEPROM SPI 1K BIT EEPROM SPI 128X8 BIT EEPROM SPI 1K BIT EEPROM SPI 128X8 BIT EEPROM SPI 1K BIT
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor
Parts packaging code SOIC SOIC SOIC MSOP SOIC SOIC
package instruction LSOP, SOP8,.25 LSSOP, TSSOP8,.25 SOP, SOP8,.25 VSSOP, TSSOP8,.16 TSSOP, TSSOP8,.19 LSSOP, TSSOP8,.25
Contacts 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 5 MHz 5 MHz 5 MHz 5 MHz 5 MHz 5 MHz
Data retention time - minimum 40 40 40 40 40 40
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PDSO-G8 R-PDSO-G8
JESD-609 code e2 e2 e2 e2 e2 e2
length 5 mm 4.4 mm 4.9 mm 2.9 mm 3 mm 4.4 mm
memory density 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 128 words 128 words 128 words 128 words 128 words 128 words
character code 128 128 128 128 128 128
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 128X8 128X8 128X8 128X8 128X8 128X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSOP LSSOP SOP VSSOP TSSOP LSSOP
Encapsulate equivalent code SOP8,.25 TSSOP8,.25 SOP8,.25 TSSOP8,.16 TSSOP8,.19 TSSOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.25 mm 1.65 mm 0.9 mm 1.05 mm 1.25 mm
Serial bus type SPI SPI SPI SPI SPI SPI
Maximum standby current 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 0.65 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 10 10 10 10 10 10
width 4.4 mm 3 mm 3.9 mm 2.8 mm 3 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
write protect HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
Terminal surface - TIN COPPER TIN COPPER Tin/Copper (Sn97.5Cu2.5) TIN COPPER Tin/Copper (Sn/Cu)
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