SIM3L167-C-GQ datasheet, PDF - EEWORLD Datasheet

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SIM3L167-C-GQ: DescriptionARM Microcontrollers - MCU 256KB, DC-DC, 40x4 LCD, AES, TQFP80; Categorysemiconductor The embedded processor and controller; File Size2MB，91 Pages; ManufacturerSilicon Laboratories; Environmental Compliance

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SIM3L167-C-GQ Overview

ARM Microcontrollers - MCU 256KB, DC-DC, 40x4 LCD, AES, TQFP80

SIM3L167-C-GQ Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Silicon Laboratories
Product Category	ARM Microcontrollers - MCU
RoHS	Details
Mounting Style	SMD/SMT
Package / Case	TQFP-80
Core	ARM Cortex M3
Data Bus Width	32 bit
Maximum Clock Frequency	50 MHz
Program Memory Size	256 kB
Data RAM Size	32 kB
ADC Resolution	12 bit
Number of I/Os	62 I/O
Operating Supply Voltage	3 V
Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 85 C
Interface Type	I2C, SPI
Packaging	Tray
Height	1.2 mm
Length	14 mm
Program Memory Type	Flash
Width	14 mm
Data RAM Type	SRAM
I/O Voltage	3 V
Moisture Sensitive	Yes
Number of ADC Channels	24
Number of Timers/Counters	3 Timer
Processor Series	SiM3L1xx
Factory Pack Quantity	119
Supply Voltage - Max	3.8 V
Supply Voltage - Min	1.98 V
Unit Weight	0.018117 oz

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SiM3L1xx

High-Performance, Low-Power, 32-Bit Precision32™

MCU Family with up to 256 kB of Flash

32-bit ARM Cortex-M3 CPU

50 MHz maximum frequency

Single-cycle multiplication, hardware division support

Nested vectored interrupt control (NVIC) with 8 priority levels

Memory

32–256 kB flash, in-system programmable

8–32 kB SRAM with configurable low power retention

Clock Sources

Internal oscillator with PLL: 23–50 MHz

Low power internal oscillator: 20 MHz

Low frequency internal oscillator (LFO): 16.4 kHz

External real-time clock (RTC) crystal oscillator

External oscillator: Crystal, RC, C, CMOS clock

Power Management

Three adjustable low drop-out (LDO) regulators

Power-on reset circuit and brownout detectors

DC-DC buck converter allows dynamic voltage scaling for

maximum efficiency (250 mW output)

Multiple power modes supported for low power optimization

Analog Peripherals

12-Bit Analog-to-Digital Converter: Up to 250 ksps 12-bit mode

2 x Low-current comparators

or 1 Msps 10-bit mode

10-Bit Current-mode Digital-to-Analog Converter

Digital and Communication Peripherals

1 x USART with IrDA and ISO7816 Smartcard support

1 x UART that operates in low power mode

2 x SPIs, 1 x I2C, 16/32-bit CRC

128/192/256-bit Hardware AES Encryption

Encoder/Decoder: Manchester and Three-out-of-Six

Integrated LCD Controller: up to 160 segments (40x4), auto-

contrast and low power operation

Timers/Counters

3 x 32-bit or 6 x 16-bit timers with capture/compare

16-bit, 6-channel counter with capture/compare/PWM and

dead-time controller with differential outputs

16-bit low power timer/advanced capture counter operational in

the lowest power mode

32-bit real time clock (RTC) with multiple alarms

Low Power Features

75 nA typical current in Power Mode 8

Low-current RTC (180 nA from LFO, 300 nA from crystal)

4 µs wakeup, register state retention and no reset required from

140 µA/MHz at 3.6 V executing from SRAM

Specialized on-chip charge pump reduces power consumption

Process/Voltage/Temperature (PVT) Monitor

5 V Tolerant Flexible I/O

Up to 62 contiguous 5 V tolerant GPIO with one priority cross-

bar providing flexibility in pin assignments

lowest power mode

175 µA/MHz at 3.6 V executing from flash

Watchdog timer

Low power mode advanced capture counter (ACCTR)

Data Transfer Peripherals

10-Channel DMA Controller

3 Channel Data Transfer Manager manages complex DMA

transfers without core intervention

On-Chip Debugging

Serial wire debug (SWD) with serial wire viewer (SWV) or JTAG

(no boundary scan) allow debug and programming

Cortex-M3 embedded trace macrocell (ETM)

Temperature Range: –40 to +85 °C

Supply Voltage: 1.8 to 3.8 V

Power

Scalable Digital LDO

Scalable Memory LDO

Scalable Analog LDO

DC-DC Buck Converter

Low Power Mode Charge Pump

Power Management Unit

32/64/128/256 kB Flash

Package Options

QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)

TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)

Core / Memory / Support

ARM Cortex M3 (50 MHz)

8/16/32 kB Retention

RAM

Analog Peripherals

SAR ADC

(12-bit 250 ksps / 10-bit 1 Msps)

Voltage Reference

Current-Source DAC

2 x Low Current Comparators

Advanced Capture Counter

Flexible Pin Muxing

10-Ch DMA Controller + 3x Data Transfer Mgr.

Watchdog

Supply Monitor

Serial Wire or JTAG Debug / Programming + ETM

Clocking / Oscillators

50 MHz PLL

Real-Time Clock w/ Dedicated Crystal Oscillator

16 kHz Low Frequency Oscillator

20 MHz Low Power Oscillator

External Clock (XTAL / RC / C / CMOS)

Clock Selection

and Gating

1 x I2C

Digital Peripherals

2 x SPI

AES

CRC

Priority Crossbar

Encoder

3 x 32-bit Timers (6 x 16-bit)

1 x UART, 1 x USART w/ IrDA/SmartCard

Encoder/Decoder

6-Channel PWM

Low-Power Timer

LCD Controller

Rev 1.1 11/14

62 Multi-Function 5V-Tolerant I/O Pins

SiM3L1xx

SiM3L1xx

Ta b l e o f C o n t e n ts

1. Related Documents and Conventions ...............................................................................5

1.1. Related Documents........................................................................................................5

1.1.1. SiM3L1xx Reference Manual.................................................................................5

1.1.2. Hardware Access Layer (HAL) API Description ....................................................5

1.1.3. ARM Cortex-M3 Reference Manual.......................................................................5

1.2. Conventions ...................................................................................................................5

2. Typical Connection Diagrams ............................................................................................6

2.1. Power .............................................................................................................................6

3. Electrical Specifications......................................................................................................8

3.1. Electrical Characteristics ................................................................................................8

3.2. Thermal Conditions ...................................................................................................... 30

3.3. Absolute Maximum Ratings..........................................................................................31

4. Precision32™ SiM3L1xx System Overview.....................................................................32

4.1. Power ........................................................................................................................... 34

4.1.1. DC-DC Buck Converter (DCDC0)........................................................................ 34

4.1.2. Three Low Dropout LDO Regulators (LDO0) ...................................................... 35

4.1.3. Voltage Supply Monitor (VMON0) ....................................................................... 35

4.1.4. Power Management Unit (PMU).......................................................................... 35

4.1.5. Device Power Modes........................................................................................... 35

4.1.6. Process/Voltage/Temperature Monitor (TIMER2 and PVTOSC0)....................... 38

4.2. I/O................................................................................................................................. 39

4.2.1. General Features.................................................................................................39

4.2.2. Crossbar .............................................................................................................. 39

4.3. Clocking........................................................................................................................ 40

4.3.1. PLL (PLL0)........................................................................................................... 41

4.3.2. Low Power Oscillator (LPOSC0) ......................................................................... 41

4.3.3. Low Frequency Oscillator (LFOSC0)................................................................... 41

4.3.4. External Oscillators (EXTOSC0).......................................................................... 41

4.4. Integrated LCD Controller (LCD0)................................................................................ 42

4.5. Data Peripherals...........................................................................................................43

4.5.1. 10-Channel DMA Controller................................................................................. 43

4.5.2. Data Transfer Managers (DTM0, DTM1, DTM2) ................................................. 43

4.5.3. 128/192/256-bit Hardware AES Encryption (AES0) ............................................ 43

4.5.4. 16/32-bit Enhanced CRC (ECRC0) .....................................................................44

4.5.5. Encoder / Decoder (ENCDEC0) .......................................................................... 44

4.6. Counters/Timers........................................................................................................... 45

4.6.1. 32-bit Timer (TIMER0, TIMER1, TIMER2)........................................................... 45

4.6.2. Enhanced Programmable Counter Array (EPCA0) ............................................. 45

4.6.3. Real-Time Clock (RTC0) ..................................................................................... 46

4.6.4. Low Power Timer (LPTIMER0)............................................................................46

4.6.5. Watchdog Timer (WDTIMER0)............................................................................46

4.6.6. Low Power Mode Advanced Capture Counter (ACCTR0)................................... 47

4.7. Communications Peripherals ....................................................................................... 48

4.7.1. USART (USART0) ............................................................................................... 48

Rev 1.1

SiM3L1xx

4.7.2. UART (UART0).................................................................................................... 48

4.7.3. SPI (SPI0, SPI1) .................................................................................................. 49

4.7.4. I2C (I2C0) ............................................................................................................ 49

4.8. Analog .......................................................................................................................... 50

4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)................................................... 50

4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0) ......................................................... 50

4.8.3. Low Current Comparators (CMP0, CMP1) .......................................................... 50

4.9. Reset Sources..............................................................................................................51

4.10.Security ........................................................................................................................ 52

4.11.On-Chip Debugging ..................................................................................................... 52

5. Ordering Information .........................................................................................................53

6. Pin Definitions.................................................................................................................... 55

6.1. SiM3L1x7 Pin Definitions ............................................................................................. 55

6.2. SiM3L1x6 Pin Definitions ............................................................................................. 62

6.3. SiM3L1x4 Pin Definitions ............................................................................................. 69

6.4. TQFP-80 Package Specifications ................................................................................ 74

6.4.1. TQFP-80 Solder Mask Design............................................................................. 77

6.4.2. TQFP-80 Stencil Design ...................................................................................... 77

6.4.3. TQFP-80 Card Assembly..................................................................................... 77

6.5. QFN-64 Package Specifications .................................................................................. 78

6.5.1. QFN-64 Solder Mask Design............................................................................... 80

6.5.2. QFN-64 Stencil Design ........................................................................................ 80

6.5.3. QFN-64 Card Assembly....................................................................................... 80

6.6. TQFP-64 Package Specifications ................................................................................ 81

6.6.1. TQFP-64 Solder Mask Design............................................................................. 84

6.6.2. TQFP-64 Stencil Design ...................................................................................... 84

6.6.3. TQFP-64 Card Assembly..................................................................................... 84

6.7. QFN-40 Package Specifications .................................................................................. 85

6.7.1. QFN-40 Solder Mask Design............................................................................... 87

6.7.2. QFN-40 Stencil Design ........................................................................................ 87

6.7.3. QFN-40 Card Assembly....................................................................................... 87

7. Revision Specific Behavior............................................................................................... 88

7.1. Revision Identification .................................................................................................. 88

Document Change List ........................................................................................................... 90

Contact Information ................................................................................................................ 91

Rev 1.1

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Description	ARM Microcontrollers - MCU 256KB, DC-DC, 40x4 LCD, AES, TQFP80	ARM Microcontrollers - MCU 256KB, DC-DC, 32x4 LCD, AES, QFN64	ARM Microcontrollers - MCU 128KB, DC-DC, 40x4 LCD, AES, TQFP80	ARM Microcontrollers - MCU 64KB, DC-DC, 32x4 LCD, AES, QFN64	Daughter Cards & OEM Boards UDP SiM3L1xx MCU Card (no LCD)	ARM Microcontrollers - MCU 128KB, DC-DC, 32x4 LCD, AES, QFN64	ARM Microcontrollers - MCU 64KB, DC-DC, 32x4 LCD, AES, QFN64	ARM Microcontrollers - MCU 256KB, DC-DC, 32x4 LCD, AES, TQFP64
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
Manufacturer	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories
Product Category	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	Daughter Cards & OEM Boards	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU
RoHS	Details	Details	Details	Details	Details	Details	Details	Details
Core	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3
Data Bus Width	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit
Minimum Operating Temperature	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C
Maximum Operating Temperature	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C
Interface Type	I2C, SPI	I2C, SPI	I2C, SPI	I2C, SPI	I2C, SPI, UART	I2C, SPI, UART, USART	I2C, SPI	I2C, SPI
Moisture Sensitive	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Factory Pack Quantity	119	260	119	160	1	160	260	160
Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	-	SMD/SMT	SMD/SMT	SMD/SMT
Package / Case	TQFP-80	QFN-64	TQFP-80	TQFP-64	-	TQFP-64	QFN-64	TQFP-64
Maximum Clock Frequency	50 MHz	50 MHz	50 MHz	50 MHz	-	50 MHz	50 MHz	50 MHz
Program Memory Size	256 kB	256 kB	128 kB	64 kB	-	128 kB	64 kB	256 kB
Data RAM Size	32 kB	32 kB	32 kB	16 kB	-	32 kB	16 kB	32 kB
ADC Resolution	12 bit	12 bit	12 bit	12 bit	-	12 bit	12 bit	12 bit
Number of I/Os	62 I/O	51 I/O	62 I/O	51 I/O	-	-	51 I/O	51 I/O
Operating Supply Voltage	3 V	3 V	3 V	3 V	-	1.25 V to 3.8 V	3 V	3 V
Packaging	Tray	Tray	Tray	Tray	-	Tray	Tray	Tray
Height	1.2 mm	0.9 mm	1.2 mm	1.2 mm	-	0.95 mm	0.9 mm	1.2 mm
Length	14 mm	9 mm	14 mm	12 mm	-	10 mm	9 mm	12 mm
Program Memory Type	Flash	Flash	Flash	Flash	-	-	Flash	Flash
Width	14 mm	9 mm	14 mm	12 mm	-	10 mm	9 mm	12 mm
Data RAM Type	SRAM	SRAM	SRAM	SRAM	-	-	SRAM	SRAM
I/O Voltage	3 V	3 V	3 V	3 V	-	-	3 V	3 V
Number of ADC Channels	24	23	24	23	-	-	23	23
Number of Timers/Counters	3 Timer	3 Timer	3 Timer	3 Timer	-	-	3 Timer	3 Timer
Processor Series	SiM3L1xx	SiM3L1xx	SiM3L1xx	SiM3L1xx	-	SiM3L1xx	SiM3L1xx	SiM3L1xx
Supply Voltage - Max	3.8 V	3.8 V	3.8 V	3.8 V	-	3.8 V	3.8 V	3.8 V
Supply Voltage - Min	1.98 V	1.98 V	1.98 V	1.98 V	-	1.25 V	1.98 V	1.98 V
Unit Weight	0.018117 oz	0.007277 oz	0.018117 oz	0.012720 oz	-	0.012720 oz	0.007277 oz	0.012720 oz

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