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PZU4.3B2,115

Description
Zener Diodes ZENER DIODE
CategoryDiscrete semiconductor    diode   
File Size177KB,12 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric View All

PZU4.3B2,115 Overview

Zener Diodes ZENER DIODE

PZU4.3B2,115 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
Parts packaging codeSOD
package instructionPLASTIC, SC-90, 2 PIN
Contacts2
Manufacturer packaging codeSOD323F
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance1000 Ω
JESD-30 codeR-PDSO-F2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.31 W
Certification statusNot Qualified
GuidelineIEC-60134
Nominal reference voltage4.3 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance2%
Working test current5 mA
Base Number Matches1
PZUxB series
Rev. 3 — 15 January 2018
Single Zener diodes in a SOD323F package
Product data sheet
1
Product profile
1.1 General description
General-purpose Zener diodes in an SOD323F (SC-90) very small and flat lead Surface
Mounted Device (SMD) plastic package.
1.2 Features
Total power dissipation: ≤ 310 mW
Tolerance series: B: approximately ±5 %; B1, B2, B3: sequential, approximately ±2 %
Small plastic package suitable for surface mounted design
Wide working voltage range: nominal 2.4 V to 36 V
1.3 Applications
General regulation functions
1.4 Quick reference data
Table 1. Quick reference data
Symbol
V
F
P
tot
Parameter
forward voltage
total power dissipation
Conditions
I
F
= 100 mA
T
amb
≤ 25 °C
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Max
1.1
310
550
Unit
V
mW
mW
[1] Pulse test: t
p
≤ 300 μs; δ ≤ 0.02
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
2
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm .

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