PL
IA
NT
Features
n
0402 size
n
Available in E12 Series
n
High frequency
n
Nickel barrier
n
RoHS compliant*
F
RE
E
Applications
n
Mobile phones
n
Cellular phones
*R
oH
S
C
OM
n
CTV, VCR, HIC, FDD
LE
AD
CI100505 Series - Multilayer Chip Inductors
General Specifications
SRF
MHz
Min.
Typ.
Electrical Specifications
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Bourns
Part No.
Inductance
@100 MHz
nH
Tol. %
Q Typ.
@500
MHz
DCR
ohm
Max.
I rms
mA
Max.
CI100505-1N0D
CI100505-1N2D
CI100505-1N5D
CI100505-1N8D
CI100505-2N2D
CI100505-2N7D
CI100505-3N3D
CI100505-3N9D
CI100505-4N7D
CI100505-5N6D
CI100505-6N8J
CI100505-8N2J
CI100505-10NJ
CI100505-12NJ
CI100505-15NJ
CI100505-18NJ
CI100505-22NJ
CI100505-27NJ
CI100505-33NJ
CI100505-39NJ
CI100505-47NJ
CI100505-56NJ
CI100505-68NJ
CI100505-82NJ
CI100505-R10J
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
@100
MHz
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
34
35
33
30
25
24
24
24
23
24
23
23
23
23
23
23
22
21
20
20
19
18
17
16
14
@1000
MHz
52
52
48
42
36
34
35
35
34
35
32
31
31
31
30
30
27
26
22
21
18
16
11
6
—
6000
6000
6000
6000
6000
6000
6000
4000
4000
4000
3900
3600
3200
2700
2300
2100
1900
1600
1300
1200
1000
750
700
600
550
13000
10000
10000
9500
9000
9000
8000
6500
5000
5000
4400
4000
3500
3500
3000
2600
2200
1900
1700
1600
1300
900
800
700
650
0.08
0.09
0.10
0.12
0.13
0.13
0.16
0.21
0.21
0.23
0.25
0.28
0.31
0.40
0.46
0.55
0.60
0.70
0.80
0.90
1.00
1.00
1.20
1.30
1.50
300
300
300
300
300
300
300
300
300
300
300
250
250
200
200
200
200
200
200
100
100
100
100
100
100
Temperature Rise
.................20 °C max. at rated current
Operating Temperature
................................-55 °C to +125 °C
Storage Temperature
................................-55 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
................................... 260 °C, 10 sec.
Moisture Sensitivity Level .....................1
ESD Classification (HBM)................. N/A
Materials
Base Material.............................Ceramic
Terminal ....................................Ag/Ni/Sn
Packaging ............... 10,000 pcs. per reel
Product Dimensions
0.5 ± 0.05
(.020 ± .002)
0.4
MAX.
(.016)
1.0 ± 0.05
(.039 ± .002)
0.5 ± 0.05
(.020 ± .002)
Recommended Layout
0.5
(.020)
REF.
0.5
(.020)
REF.
Packaging Specifications
178.0
(7.00)
DIA.
2.0 ± 0.8
(.079 ± .031)
12.0
(.472)
1.0
(.040)
REF.
0.4
REF.
(.016)
MM
DIMENSIONS:
(INCHES)
21.0 ± 0.8
(.827 ± .031)
13.0 ± 0.5
(.512 ± .020)
DIA.
50.0
(1.969)
13.0 ± 0.5
DIA.
(.512 ± .020)
9.0
(.354)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SRF0504 Series - Line Filter
CI100505 Series - Multilayer Chip Inductors
Electrical Specifications
1000
Inductance Characteristics
100
80
Q Characteristics
Inductance (nH)
100
Q
10
10nH
5.6nH
3.3nH
60
40
20
10nH
3.3nH
5.6nH
1
10
Frequency (MHz)
100
1000
10000
0
10
Frequency (MHz)
100
1000
10000
REV. 03/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.