EEWORLDEEWORLDEEWORLD

Part Number

Search

DS34S132GN

Description
Telecom Interface ICs 32Port TDM-Over-Pack Transport Device
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,194 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric Compare View All

DS34S132GN Online Shopping

Suppliers Part Number Price MOQ In stock  
DS34S132GN - - View Buy Now

DS34S132GN Overview

Telecom Interface ICs 32Port TDM-Over-Pack Transport Device

DS34S132GN Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeBGA
package instruction27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676
Contacts676
Reach Compliance Codenot_compliant
JESD-30 codeS-PBGA-B676
length27 mm
Number of functions1
Number of terminals676
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height2.41 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width27 mm
19-4750; Rev 1; 7/11
DS34S132
32-Port TDM-over-Packet IC
General Description
The IETF PWE3 SAToP/CESoPSN/HDLC-compliant
DS34S132 provides the interworking functions that
are required for translating TDM data streams into
and out of TDM-over-Packet (TDMoP) data streams
for L2TPv3/IP, UDP/IP, MPLS (MFA-8), and Metro
Ethernet (MEF-8) networks while meeting the jitter
and wander timing performance that is required by
the public network (ITU G.823, G.824, and G.8261).
Up to 32 TDM ports can be translated into as many
as 256 individually configurable pseudowires (PWs)
for transmission over a 100/1000Mbps Ethernet port.
Each TDM port’s bit rate can vary from 64Kbps to
2.048Mbps to support T1/E1 or slower TDM rates.
PW interworking for TDM-based serial HDLC data is
also supported. A built-in time-slot assignment (TSA)
circuit provides the ability to combine any group of
time slots (TS) from a single TDM port into a single
PW. The high level of integration provides the perfect
solution for high-density applications to minimize
cost, board space, and time to market.
Features
32 Independent TDM Ports with Serial Data,
Clock, and Sync (Data = 64Kbps to 2.048Mbps)
One 100/1000Mbps (MII/GMII) Ethernet MAC
256 Total PWs, 32 PW per TDM Port, with Any
Combination of TDMoP and/or HDLC PWs
PSN Protocols: L2TPv3 or UDP Over IP (IPv4 or
IPv6), Metro Ethernet (MEF-8), or MPLS (MFA-8)
0, 1, or 2 VLAN Tags (IEEE 802.1Q)
Synchronous or Asynchronous TDM Port
Timing
One Clock Recovery Engine per TDM Port with
One Assignable as a Global Reference
Supported Clock Recovery Techniques
Adaptive Clock Recovery
Differential Clock Recovery
Absolute and Differential Timestamps
Independent Receive and Transmit Interfaces
Two Clock Inputs for Direct Transmit Timing
For Structured T1/E1, Each TDM Port Includes
DS0 TSA Block for any Time Slot to Any PW
32 HDLC/CES Engines (256 Total)
With or Without CAS Signaling
For Unstructured, each TDM Port Includes
One HDLC/SAT Engine (32 Total)
Any data rate from 64Kbps to 2.048Mbps
32-Bit or 16-Bit CPU Processor Bus
CPU-Based OAM and Signaling
UDP-specific
“Special” Ethernet Type
Inband VCCV
ARP
MEF OAM
NDP/IPv6
Broadcast DA
DDR SDRAM Interface
Low-Power 1.8V Core, 3.3V I/O, 2.5V SDRAM
Applications
TDM Circuit Emulation Over PSN
TDM Leased-Line Services Over PSN
TDM Over BPON/GPON/EPON
TDM Over Cable
TDM Over Wireless
Cellular Backhaul
Multiservice Over Unified PSN
HDLC-Encapsulated Data Over PSN
Functional Diagram
CPU Interface
DS34S1328
32 TDM Ports
32 Serial
Clock &
Data
Interfaces
T1/E1
TSA
Circuit
Emulation
& HDLC
Engines
Buffer
Packet
Generator
Packet
Classifier
100/1000
Ethernet
MAC
MII/
GMII
Ordering Information
PART
DS34S132GNA2
DS34S132GNA2+
PORTS TEMP RANGE PIN-PACKAGE
32
32
-40°C to +85°C 676 BGA
-40°C to +85°C 676 BGA
BERT, CAS &
Conditioning
Manager
Adapter
Clock
+Denotes a lead(Pb)-free/RoHS-compliant package.
DDR SDRAM
Interface
Clock Inputs
& Outputs
Maxim Integrated Products 1
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple
revisions of any device may be simultaneously available through various sales channels. For information about device
errata, go to:
www.maxim-ic.com/errata.
For pricing, delivery, and ordering information, please contact Maxim Direct at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

DS34S132GN Related Products

DS34S132GN DS34S132GN+ DS34S132GNA2+
Description Telecom Interface ICs 32Port TDM-Over-Pack Transport Device Telecom Interface ICs 32Port TDM-Over-Pack Transport Device Telecom Interface ICs 32Port TDM-Over-Pack Transport Device
Is it Rohs certified? incompatible conform to conform to
Maker Maxim Maxim Maxim
package instruction 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676 HBGA, BGA,
Reach Compliance Code not_compliant compliant compliant
length 27 mm 27 mm 27 mm
Number of functions 1 1 1
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
encapsulated code HBGA HBGA BGA
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 NOT SPECIFIED
Maximum seat height 2.41 mm 2.41 mm 2.41 mm
Nominal supply voltage 1.8 V 1.8 V 3.3 V
Telecom integrated circuit types FRAMER FRAMER FRAMER
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal pitch 1 mm 1 mm 1 mm
Maximum time at peak reflow temperature NOT SPECIFIED 30 NOT SPECIFIED
width 27 mm 27 mm 27 mm
Parts packaging code BGA BGA -
Contacts 676 676 -
JESD-30 code S-PBGA-B676 S-PBGA-B676 -
Number of terminals 676 676 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
Package shape SQUARE SQUARE -
Package form GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG -
Certification status Not Qualified Not Qualified -
surface mount YES YES -
Terminal form BALL BALL -
Terminal location BOTTOM BOTTOM -
Is it lead-free? - Lead free Lead free
ECCN code - EAR99 EAR99
Factory Lead Time - 16 weeks 10 weeks
Humidity sensitivity level - 3 3

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1297  1680  1301  1870  2176  27  34  38  44  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号