S9S12XF384J2MLMR datasheet, PDF

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S9S12XF384J2MLMR: DescriptionIC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,112PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size9MB，1306 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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S9S12XF384J2MLMR Overview

IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,112PIN,PLASTIC

S9S12XF384J2MLMR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	4000174735
Reach Compliance Code	compliant
Country Of Origin	Malaysia
ECCN code	EAR99
YTEOL	7.95
Has ADC	YES
Address bus width
bit size	16
CPU series	CPU12
maximum clock frequency	16 MHz
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G112
JESD-609 code	e3
length	20 mm
Humidity sensitivity level	3
Number of I/O lines	91
Number of terminals	112
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP112,.87SQ
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	260
power supply	1.8,3.3/5 V
Certification status	Not Qualified
RAM (bytes)	24576
rom(word)	393216
ROM programmability	FLASH
Filter level	AEC-Q100
speed	40 MHz
Maximum slew rate	110 mA
Maximum supply voltage	1.98 V
Minimum supply voltage	1.72 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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MC9S12XF512 Reference Manual

Covers

MC9S12XF512

MC9S12XF384

MC9S12XF256

MC9S12XF128

S12X

Microcontrollers

MC9S12XF512RMV1

Rev.1.20

10-Nov-2010

freescale.com

Chapter 1

MC9S12XF-Family Reference Manual

1.1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

1.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

1.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

1.1.3 Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

1.1.4 MC9S12XF512 - Address Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

1.1.5 Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

1.1.6 Part ID Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

1.2.1 System Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

1.2.2 Signal Properties Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

1.2.3 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

1.2.4 EXTAL, XTAL — Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

1.2.5 RESET — External Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

1.2.6 TEST — Test Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

1.2.7 BKGD / MODC — Background Debug and Mode Pin . . . . . . . . . . . . . . . . . . . . . . . . . 55

1.2.8 Port Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

1.2.9 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

System Clock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

1.4.1 Chip Conﬁguration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

1.4.2 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

1.4.3 Freeze Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

1.6.1 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

1.6.2 Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

1.6.3 Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

EPIT External Trigger Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

ATD External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

MPU Conﬁguration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

VREG Conﬁguration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

1.10.1 Temperature Sensor Conﬁguration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

BDM Conﬁguration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

FlexRay IPLL (CGMIPLL) Conﬁguration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

1.12.1 CGMIPLL function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

1.12.2 Entry into and exit from low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Oscillator Conﬁguration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

1.10

1.11

1.12

1.13

Chapter 2

S12XE Clocks and Reset Generator (S12XECRG)

2.1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

2.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

MC9S12XF - Family Reference Manual, Rev.1.20

Freescale Semiconductor

S9S12XF384J2MLMR Related Products

	S9S12XF384J2MLMR	MC9S12XF512MLM	S9S12XF512J2VLM	S9S12XF384J2CLHR	MC9S12XF512MLH
Description	IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,112PIN,PLASTIC	16-bit Microcontrollers - MCU 512K Flash, 32K Ram	16-bit Microcontrollers - MCU 512K FLASH 32K RAM-FLEX	16-bit Microcontrollers - MCU G9S12XF384J2CLH/QFP64///	16-bit Microcontrollers - MCU 512K Flash, 32K Ram
Is it Rohs certified?	conform to	conform to	conform to	-	conform to
Reach Compliance Code	compliant	unknown	unknown	-	unknown
ECCN code	EAR99	EAR99	-	-	EAR99
bit size	16	16	-	-	16
CPU series	CPU12	CPU12	-	-	CPU12
JESD-30 code	S-PQFP-G112	S-PQFP-G112	-	-	S-PQFP-G64
JESD-609 code	e3	e3	-	-	e3
Humidity sensitivity level	3	3	-	-	3
Number of terminals	112	112	-	-	64
Maximum operating temperature	125 °C	125 °C	-	-	125 °C
Minimum operating temperature	-40 °C	-40 °C	-	-	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY
encapsulated code	QFP	QFP	-	-	QFP
Encapsulate equivalent code	QFP112,.87SQ	QFP112,.87SQ	-	-	QFP64,.47SQ,20
Package shape	SQUARE	SQUARE	-	-	SQUARE
Package form	FLATPACK	FLATPACK	-	-	FLATPACK
Peak Reflow Temperature (Celsius)	260	260	-	-	260
power supply	1.8,3.3/5 V	1.8,5 V	-	-	1.8,5 V
Certification status	Not Qualified	Not Qualified	-	-	Not Qualified
RAM (bytes)	24576	32768	-	-	32768
rom(word)	393216	524288	-	-	524288
ROM programmability	FLASH	FLASH	-	-	FLASH
speed	40 MHz	40 MHz	-	-	40 MHz
Maximum slew rate	110 mA	110 mA	-	-	110 mA
surface mount	YES	YES	-	-	YES
technology	CMOS	CMOS	-	-	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	-	-	AUTOMOTIVE
Terminal surface	TIN	Matte Tin (Sn)	-	-	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	-	-	GULL WING
Terminal pitch	0.65 mm	0.635 mm	-	-	0.5 mm
Terminal location	QUAD	QUAD	-	-	QUAD
Maximum time at peak reflow temperature	40	40	-	-	40
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	-	MICROCONTROLLER, RISC
Is it lead-free?	-	Lead free	Lead free	-	Lead free
Base Number Matches	-	1	1	-	1

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