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74LCX541 — Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs
December 2013
74LCX541
Low Voltage Octal Buffer/Line Driver
with 5V Tolerant Inputs and Outputs
Features
■
5V tolerant input and outputs
■
2.3V–3.6V V
CC
specifications provided
■
6.5ns t
PD
max (V
CC
=
3.3V), 10µA I
CC
max
■
Power-down high impedance inputs and outputs
■
Supports live insertion/withdrawal
(1)
■
±24 mA output drive (V
CC
=
3.0V)
■
Implements p
roprietary
noise/ EMI reduction circuitry
■
Latch-up performance exceeds JEDEC 78 conditions
■
ESD performance
General Description
The LCX541 is an octal buffer/line driver designed to be
employed as memory and address drivers, clock drivers
and bus oriented transmitter/receivers. The LCX541 is a
non inverting option of the LCX540.
This device is similar in function to the LCX244 while
providing flow-through architecture (inputs on opposite
side from outputs). This pinout arrangement makes this
device especially useful as an output port for micropro-
cessors, allowing ease of layout and greater PC board
density.
The LCX541 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX541 is fabricated with an advanced CMOS
technology to achieve high speed operation while
maintaining CMOS low power dissipation.
– Human body model
>
2000V
– Machine model
>
200V
■
Leadless DQFN package
Note:
1. To ensure the high impedance state during power up
or down, OE should be tied to V
CC
through a pull-up
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
Ordering Information
Order Number
74LCX541WM
74LCX541SJ
74LCX541BQX
(2)
74LCX541MSA
74LCX541MTC
Package
Number
M20B
M20D
MLP20B
MSA20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 4.5mm
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
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Embedded System
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