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MAZW000H: DescriptionSilicon planar type For surge absorption circuit; File Size65KB，3 Pages; ManufacturerPanasonic; Websitehttp://www.panasonic.co.jp/semicon/e-index.html

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MAZW000H Overview

Silicon planar type For surge absorption circuit

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ESD Diodes

MAZW000H Series

Silicon planar type

Unit: mm

For surge absorption circuit

■

Features

•

Two elements anode-common type

•

SSS-Mini type 3-pin package

0.33

+0.05

–0.02

0.10

+0.05

–0.02

(0.40) (0.40)

0.80

±0.05

1.20

±0.05

5˚

0.15 min.

0.23

+0.05

–0.02

■

Absolute Maximum Ratings

25°C

Parameter

Total power dissipation

Junction temperature

Storage temperature

Symbol

tot

stg

Rating

150

−55

+150

Unit

°C

0 to 0.01

0.52

±0.03

5˚

Note) *: P

tot

= 150 mW achieved with a printed circuit board.

1: Cathode 1

2: Cathode 2

3: Anode 1, 2

SSSMini3-F1 Package

Internally connected circuit

■

Common Electrical Characteristics

= 25°C

3°C

Parameter

Zener voltage

Zener rise operating resistance

Zener operating resistance

Reverse current

Symbol

Conditions

Specified value

Refer to the list of the

electrical characteristics

within part numbers

Min

Typ

Max

Unit

Ω

µA

Note) 1. Measuring methods are based JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.

2. Electrostatic breakdown voltage is

±10

Test method: IEC1000-4-2 (C

150 pF, R

330

Ω,

Contact discharge: 10 times)

3. *: The temperature must be controlled 25°C for V

mesurement.

value measured at other temperature must be adjusted to V

(25°C)

guaranted 20 ms after current flow.

0.15 max.

0.15 min.

0.80

±0.05

1.20

±0.05

Publication date: 30 June, 2003

SKE00019AED

Request for your special attention and precautions in using the technical information

and semiconductors described in this material

(1) An export permit needs to be obtained from the competent authorities of the Japanese Government

if any of the products or technologies described in this material and controlled under the "Foreign

Exchange and Foreign Trade Law" is to be exported or taken out of Japan.

(2) The technical information described in this material is limited to showing representative characteris-

tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-

tual property right or any other rights owned by our company or a third party, nor grants any license.

(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the

product or technologies as described in this material.

(4) The products described in this material are intended to be used for standard applications or general

electronic equipment (such as office equipment, communications equipment, measuring instru-

ments and household appliances).

Consult our sales staff in advance for information on the following applications:

•

Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,

combustion equipment, life support systems and safety devices) in which exceptional quality and

reliability are required, or if the failure or malfunction of the products may directly jeopardize life or

harm the human body.

•

Any applications other than the standard applications intended.

(5) The products and product specifications described in this material are subject to change without

notice for modification and/or improvement. At the final stage of your design, purchasing, or use of

the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that

the latest specifications satisfy your requirements.

(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-

mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-

wise, we will not be liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of

incidence of break down and failure mode, possible to occur to semiconductor products. Measures

on the systems such as redundant design, arresting the spread of fire or preventing glitch are

recommended in order to prevent physical injury, fire, social damages, for example, by using the

products.

(7) When using products for which damp-proof packing is required, observe the conditions (including

shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets

are individually exchanged.

(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written

permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL

MAZW000H Related Products

	MAZW000H	MAZW062H	MAZW082H	MAZW068H	MAZW120H	MAZW100H
Description	Silicon planar type For surge absorption circuit	Silicon planar type For surge absorption circuit	Silicon planar type For surge absorption circuit	Silicon planar type For surge absorption circuit	Silicon planar type For surge absorption circuit	Silicon planar type For surge absorption circuit
Is it Rohs certified?	-	conform to	conform to	conform to	-	conform to
Maker	-	Panasonic	Panasonic	Panasonic	Panasonic	Panasonic
Parts packaging code	-	DFP	DFP	DFP	DFP	DFP
package instruction	-	R-PDSO-F3	R-PDSO-F3	R-PDSO-F3	R-PDSO-F3	R-PDSO-F3
Contacts	-	3	3	3	3	3
Reach Compliance Code	-	unknow	unknow	unknow	unknow	unknow
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99
Shell connection	-	ANODE	ANODE	ANODE	ANODE	ANODE
Configuration	-	COMMON ANODE, 2 ELEMENTS	COMMON ANODE, 2 ELEMENTS	COMMON ANODE, 2 ELEMENTS	COMMON ANODE, 2 ELEMENTS	COMMON ANODE, 2 ELEMENTS
Diode component materials	-	SILICON	SILICON	SILICON	SILICON	SILICON
Diode type	-	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code	-	R-PDSO-F3	R-PDSO-F3	R-PDSO-F3	R-PDSO-F3	R-PDSO-F3
JESD-609 code	-	e6	e6	e6	-	e6
Humidity sensitivity level	-	1	1	1	-	1
Number of components	-	2	2	2	2	2
Number of terminals	-	3	3	3	3	3
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	-	260	260	260	-	260
polarity	-	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL
Maximum power dissipation	-	0.15 W	0.15 W	0.15 W	0.15 W	0.15 W
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	-	YES	YES	YES	YES	YES
technology	-	ZENER	ZENER	ZENER	ZENER	ZENER
Terminal surface	-	Tin/Bismuth (Sn/Bi)	Tin/Bismuth (Sn/Bi)	Tin/Bismuth (Sn/Bi)	-	Tin/Bismuth (Sn/Bi)
Terminal form	-	FLAT	FLAT	FLAT	FLAT	FLAT
Terminal location	-	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	10	10	10	-	10

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