P
OLYFUSE
®
R
ESETTABLE
F
USES
This product is not recommended
for new designs. Please refer to
Littelfuse No. 1812L.
SMD1812
SMD Type, 6 V - 60 V
Standard
UL 1434 1
st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
cULus Recognition
TÜV
Specifications
Packaging
A
Materials
Terminals:
Blistertape and reel Ø 178 mm
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Lead free plating on request
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Reflow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
Approvals
Features
is also designed for surface-
This product line
mount applications. The products with 1812-mil
footprint range in hold currents from 0.1 A to
2.6 A and voltage from 6 V to 60 V. These devices
are suited for PC mother board, computer periph-
eral products and general electronics applications.
Suitable for reflow soldering.
Dimensions (mm)
Solder pad Layout (mm)
3.45
3.15
*
*
1.78
1.78
Dimensions (mm)
Model
SMD1812P010TS/TF
SMD1812P014TS/TF
SMD1812P020TS/TF
SMD1812P050TS/TF
SMD1812P075TS/TF
SMD1812P075TS/TF/24
SMD1812P110TS/TF
SMD1812P110TS/TF/16
SMD1812P125TS/TF
SMD1812P150TS/TF
SMD1812P150TF/12
SMD1812P160TS/TF
SMD1812P160TS/TF/8
SMD1812P200TS/TF
SMD1812P260TS/TF
* only type "TF"
D
Min
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
A
Min Max
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
Min Max
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
B
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
Min Max
0.75
0.75
0.55
0.50
0.50
0.75
0.50
0.75
0.75
0.75
0.75
0.75
0.75
0.75
1.00
C
1.25
1.95
1.00
0.75
0.75
1.55
0.75
1.25
1.25
1.25
1.25
1.25
1.25
1.55
1.60
Min Max
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
E
0.65
0.65
0.65
0.50
0.50
0.65
0.50
0.65
0.50
0.50
0.65
0.65
0.65
0.50
0.50
packaging quantity
tape
1,500
1,500
2,000
2,000
2,000
1,500
2,000
1,500
1,500
1,500
1,500
1,500
1,500
1,500
1,000
cURus
•
•
•
•
•
•
•
•
•
•
•
•
•
p
•
•
•
•
•
SMD1812P010TS/TF
SMD1812P014TS/TF
SMD1812P020TS/TF
SMD1812P050TS/TF
SMD1812P075TS/TF
SMD1812P075TS/TF/24
SMD1812P075TF/33
SMD1812P110TS/TF
SMD1812P110TS/TF/16
SMD1812P110TF/33
SMD1812P125TS/TF
SMD1812P150TS/TF
SMD1812P150TF/12
SMD1812P150TF/24
SMD1812P160TS/TF
SMD1812P160TS/TF/8
SMD1812P160TF/12
SMD1812P200TS/TF
SMD1812P260TS/TF
0.10
0.14
0.20
0.50
0.75
0.75
0.75
1.10
1.10
1.10
1.25
1.50
1.50
1.50
1.60
1.60
1.60
2.00
2.60
0.30
0.34
0.40
1.00
1.50
1.50
1.50
2.20
1.95
1.95
2.50
3.00
3.00
3.00
2.80
2.80
2.80
3.50
5.20
30
60
30
15
13.2
24
33
6
16
33
15
6
12
24
6
8
12
8
6
10/100*
10/100*
10/100*
40/100*
40/100*
40/100*
20
40/100*
40/100*
20
40/100*
40/100*
40/100*
20
40/100*
40/100*
20/100*
40/100*
40/100*
1.50 @ 0.50
0.15 @ 1.50
0.02 @ 8.00
0.15 @ 8.00
0.20 @ 8.00
0.20 @ 8.00
0.20 @ 8.00
0.30 @ 8.00
0.50 @ 8.00
0.50 @ 8.00
0.40 @ 8.00
0.50 @ 8.00
0.50 @ 8.00
1.50 @ 8.00
1.00 @ 8.00
1.00 @ 8.00
1.00 @ 8.00
2.00 @ 8.00
2.50 @ 8.00
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1.600
1.500
0.800
0.150
0.110
0.110
0.110
0.040
0.060
0.060
0.070
0.040
0.040
0.040
0.030
0.030
0.030
0.020
0.015
7.000
4.000
2.900
0.600
0.260
0.200
0.260
0.120
0.120
0.120
0.160
0.070
0.070
0.070
0.066
0.066
0.066
0.040
0.030
15.000
6.000
5.000
1.000
0.450
0.290
0.400
0.210
0.180
0.200
0.250
0.110
0.110
0.120
0.100
0.100
0.100
0.060
0.047
* Approvals for 100 A pending
Please choose TS for SnPb and TF for Sn plating
NOTE:
Power dissipated from device when in the tripped state at 20 °C still air.
P
d
=
I
hold
= Hold current: maximum current device will pass without tripping in 20 °C still air.
Minimum resistance of device in initial (un-soldered) state.
R
min
=
I
trip
= Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
R
1max
=
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
Caution: Operation beyond the specified rating may result in damage and possible arcing and
fl
ame.
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
Specifications are subject to change without notice
Order
Information
Qty.
Order-
Number
Model
Packaging
040606
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
www.littelfuse.com
TÜV
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Permissible continuous operating current is
≤
100 % at ambient temperature of 20 ºC (68 ºF).
Model
I
hold
I
Trip
V
max. dc
I
max.
max. time to trip
(A)
(A)
(A)
(V)
(A)
(s @ A)
P
d max.
(W)
Resistance
Approvals
R
min.
(
Ω
) R
typ.
(
Ω
) R
I max.
(
Ω
)
NXP MCU
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