HD
D-Sub connectors - Stamped and Formed Contacts
RIGHT ANGLE
HIGH DENSITY CONNECTORS
Specifications
M N C AR TER STI C
AI
H AC I
S
Materials and Platings
Shells
Insulator
Contacts
Steel, tin over nickel plating
Glass-filled thermoplastic, UL 94V- 0
Brass, selected gold in mating area;
2.54µm (100 µ") min.tin on
termination area over 1.27µm
(50µ") min.nickel
Brass, 2.54µm (100µ") min.nickel plated
Phosphor bronze or Brass, 2.54µm
(100µ") min.nickel plated
Brass, 2.54µm (100µ") min.nickel plated
D R PTI O
ESC I
N
APPLI C O S
ATI N
• Connectors according to: MIL
C24308
• UL File:
E149426
Amphenol’s high density
D-Sub connectors complement
Amphenol’s extensive D-Sub
connector line. This line offers many
superior features, high performance
level and low installation cost.
The decreased contact spacing
accommodates greater signal
density in comparison to conventional
D-Sub connectors.
Rear insert
Boardlock
Screwlock
Electrical Data
Current rating
Voltage
rating
Withstanding
voltage
Insulation resistance
Contact resistance
3A
250V AC/ rms 50Hz
1000V AC/rms 50Hz for one minute
5000MΩ at 500V DC
10mΩ max
Economical
right angle PCB
mount
connectors
•
Industrial
•
Telecom
•
Any industry standard
I / O connections
Climatic Data
Operating temperature
-55°C to +125°C
Salt spray
24 hours
Mechanical Data
Single contact insertion force
Single contact withdrawal force
Mating and unmating force
Unit: kg ( lb)
No. of Cts
15
26
44
62
M
ate (max)
3.81 (8.42)
5.95 (13.16)
9.26 (20.46)
13.48 (29.78)
• Gold flash
• 0.4µm (15µ") Gold
• 0.76 µm (30µ") Gold
Unmate (min)
0.52 (1.14)
1.05 (2.32)
1.37 (3.02)
1.76 (3.88)
0.34kg (0.75lb) max.
0.02kg (0.044lb) min.
Standard plating thickness
HD / E19
TEC N C D
H I AL ATA
How to order
L
RoHS Compliant
... HD ... ... ... ... ... C309
Plating option
valid only for 0.76µm (30µ")
part numbers to be written
as follow:
or
77...................C309
717.................C309
Gold
flash
77:
tinned shell
for receptable
717:
tinned shell
+ dimples
for plug
177:
tinned shell
for receptable
777:
tinned shell
+ dimples
for plug
0.4µm
(15µ")
Series
High density
Front mounting option
Blank
= 3.05mm (.120”) rivet
4R
= 4-40 rear insert
4F
= 4-40 front screwlock
3R
= M3 rear insert
3F
= M3 front screwlock
Grounding option
CO
CH
C4
C3
= Grounding bracket
= Grounding bracket +
PCB boardlock
= Grounding bracket +
PCB 4-40 insert
= Grounding bracket +
PCB M3 insert
Contact type
P
= Plug
S
= Socket
Examples:
L 717 HD E15 P D1 CH 4R C309
L 177 HD A26 S D0 CO 3F
Footprint option
D0
= 1.5mm (.059”)
D1
= 8.89mm (.350”)
D2
= 5.08mm (.200”)
D3
= 2.50mm (.098”)
For special request, please consult factory
Do not hesitate to contact us for further information
Amphenol IT & Communication Products
Block A3/A4, The 4th Industrial District of
Industrial Headquarters, Dong Keng Road
Gong Ming Town, Shen Zhen China
Fax:+86(0)755 2754 9955
Technical Support
Tel:+86(0)755 2717 7945
Info-dsub@amphenol.com.cn
http://www.dsubconnector.com
E19/H
The information given in this document are as a guideline only. We reserve the right to modify our products in any way we deem necessary. Any duplication is prohibited, unless approved in writing.
Configuration
E15, A26, B44, C62
RF/Wirelessly
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