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935315224557

Description
Multifunction Peripheral
CategoryMicrocontrollers and processors   
File Size4MB,207 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

935315224557 Overview

Multifunction Peripheral

935315224557 Parametric

Parameter NameAttribute value
MakerNXP
package instruction,
Reach Compliance Codeunknown
Base Number Matches1
NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SXCEC
Rev. 4, 11/2018
MCIMX6XxExxxxxB
MCIMX6XxExxxxxC
i.MX 6SoloX Applications
Processors for Consumer
Products
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 1 on page 3
1
Introduction
1
The i.MX 6SoloX processors represent NXP
Semiconductor’s latest achievement in integrated
multimedia-focused products offering high performance
processing with a high degree of functional integration,
targeted towards the growing market of connected
devices.
The i.MX 6SoloX processor features NXP’s advanced
implementation of the single Arm
®
Cortex
®
-A9 core,
which operates at speeds of up to
1 GHz,
in addition to
the Arm Cortex-M4 core, which operates at speeds of up
to 227 MHz. This type of heterogeneous multicore
architecture provides greater levels of system
integration, smart low-power system awareness, and fast
real-time responsiveness. The i.MX 6SoloX includes a
GPU processor capable of supporting 2D and 3D
operations, a wide range of display and connectivity
options, and integrated power management. Each
processor provides a 32-bit
DDR3/DDR3L/LPDDR2-800 memory interface and a
number of other interfaces for connecting peripherals,
such as WLAN, Bluetooth™, GPS, displays, and camera
sensors.
2
3
4
5
6
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19
3.2 Recommended Connections for Unused Analog
Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 21
4.2 Power Supplies Requirements and Restrictions . . 34
4.3 Integrated LDO Voltage Regulator Parameters . . 35
4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 37
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 38
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44
4.8 Output Buffer Impedance Parameters. . . . . . . . . . 47
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 50
4.10 Multi-mode DDR Controller (MMDC). . . . . . . . . . . 62
4.11 General-Purpose Media Interface (GPMI) Timing. 63
4.12 External Peripheral Interface Parameters . . . . . . . 71
4.13 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 118
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 118
5.2 Boot Device Interface Allocation . . . . . . . . . . . . . 120
Package Information and Contact Assignments . . . . . . 128
6.1 i.MX 6SoloX Signal Availability by Package . . . . 128
6.2 Signals with Different States During Reset and After
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
6.3 19x19 mm Package Information . . . . . . . . . . . . . 131
6.4 17x17 mm Package Information . . . . . . . . . . . . . 150
6.5 14x14 mm Package Information . . . . . . . . . . . . . 185
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products

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