PF816-AG11D40 datasheet, PDF - EEWORLD Datasheet

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PF816-AG11D40: DescriptionIC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Press Fit; Categorysocket; File Size57KB，3 Pages; ManufacturerThomas & Betts Corporation; Websitehttp://www.tnb.com/

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PF816-AG11D40 Overview

IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Press Fit

PF816-AG11D40 Parametric

Parameter Name	Attribute value
Maker	Thomas & Betts Corporation
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	COMPLIANT FIT HOLE SIZE=.040\"
body width	0.4 inch
subject depth	0.18 inch
body length	0.8 inch
Contact to complete cooperation	AU
Contact completed and terminated	TIN OVER NICKEL
Contact material	BE-CU
Contact style	RND PIN-SKT
current rating	3 A
Device slot type	IC SOCKET
Type of equipment used	DIP16
Dielectric withstand voltage	1000VAC V
Shell material	POLYESTER
Insulation resistance	5000000000 Ω
Manufacturer's serial number	PF800
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.3 mm
Terminal pitch	2.54 mm
Termination type	PRESS FIT
Base Number Matches	1

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PF510 & PF800 Series

Pressfit SIP & DIP Sockets

PF510-AG95D-14

PF828-AG95D-28

FEATURES:

• Press fit design does not require soldering

• Available in two sizes to fit .028” (0,71) or .040” (1,02) finished hole

• Available in 8 through 64 pin DIP or 1 to 20 pin SIP packages

• Precision four-finger inner contact provides concentric funnel entry for

easy lead insertion

PERFORMANCE SPECIFICATIONS:

MECHANICAL

Vibration ........................ Passed MIL-STD-1344, Method 2005,

Condition II

Shock .............................. Passed MIL-STD-1344, Method 2004,

Condition C, 100 G's

Durability ...................... Passed MIL-STD-1344, Method 2016

Normal Force ................ 200 Grams (7.1 oz.) average with .018" (0,46) dia.

polished steel pin (typ.)

Inner Contact

Retention .................... 7.5 Lbs. per line average

Sleeve Retention

in Plastic .................... 3.0 Lbs. per line minimum

Pin Retention in Board .. 5.0 Lbs. min. per MIL-STD 2166

Insertion Force .............. 179 Grams (6.3 oz.) average with a .018" (0,46)

dia. polished steel pin

Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)

dia. polished steel pin

ELECTRICAL

Contact Resistance ........ 10 Milliohms

Contact Rating .............. 3 Amps

Capacitance .................... 1.0 pF per MIL-STD 202, Method 305

(contact to contact)

Insulation Resistance .... 5,000 Megohms min. per MIL-STD-1344,

Method 3003.1

Dielectric Withstanding

Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,

Method 3001.1

ENVIRONMENTAL

Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II

Operation Temperature .. Gold inner contact -55° C to +125° C,

Tin/lead inner contact -55° C to +105° C

Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A

Gas Tight ........................ Passed EIA-364-36

APPLICATION DIMENSIONS:

• PCB Thickness Range: Standard .093" (2,36) minimum

• IC Pin Dimension Range: .016"(0,41) thru .021" (0,53) dia.,

.105" (2,67) min. length

• PCB Hole Size Range: .028"

.002" (0,71

0,05) and .040

.003"

(1,02

0,13)

MATERIAL SPECIFICATIONS:

Insulator ........................ Thermoplastic polyester, UL 94V-0

Inner Contact .................. Beryllium copper, gold or tin/lead plated

Sleeve ............................ Brass, tin/lead plated

Quality & Innovation From The

Product Group

Thomas & Betts

1555 Lynnfield Road

Memphis, TN 38119

(901) 682-8221 FAX (901) 537-8805

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