INTERCONNECTS
SERIES 830, 831, 832, 833 • 2mm GRID HEADERS AND SOCKETS •
SINGLE AND DOUBLE ROW STRIPS
Number of Pins
X 2mm
2mm
•
Series 830 single & double row interconnects
have 2mm pin spacing and permit board
stacking as low as .322”
.019 DIA.
.154
•
Pin headers (830 & 832 series) use MM #5012
.110
.157
pins. See page 208 for details
.023 DIA.
.164
•
Sockets (831 & 833 series) use MM #1802
receptacles and accept pin diameters from
.015”-.025”. See page 169 for details
2mm
FIG. 1
4mm
2mm
Number of Pins
X 2mm / 2
•
Contact is rated at 3 amps
•
Insulators are high temperature thermoplastic,
suitable for all soldering operations
.019 DIA.
.154
ORDERING INFORMATION
Series 830...001
Single Row Pin Header
830 XX 0_ _ 10 001000
Specify number of pins
2mm
.110
.157
.023 DIA.
FIG. 1
Series 832...001
.164
01-50
Double Row Pin Header
832 XX _ _ _ 10 001000
004-100
For
Electrical, Mechanical
& Enviromental Data,
See page 264
FIG. 2
2mm
Number of Pins
X 2mm
FIG. 2
RoHS - 2
Specify number of pins
XX=Plating Code
See Below
10
10
µ”
Au
.110
.083
2011/65/EU
.145
.165
SPECIFY PLATING CODE XX=
.020 DIA.
90
200
µ”
Sn/Pb
40
200
µ”
Sn
Pin Plating
.125
Series 831...001
2mm
Single Row Socket
831 XX 0_ _ 10 001000
01-50
FIG. 3
4mm
2mm
Number of Pins
X 2mm / 2
FIG. 3
Series 833...001
Specify number of pins
Double Row Socket
004-100
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.110 .083
.145
Specify number of pins
.165
.020 DIA.
.125
2011/65/EU
RoHS - 2
XX=Plating Code
See Below
91
10
µ”
Au
2mm
SPECIFY PLATING CODE XX=
Sleeve (Pin)
Contact (Clip)
93
30
µ”
Au
41
200
µ”
Sn
10
µ”
Au
43
200
µ”
Sn
30
µ”
Au
47
200
µ”
Sn
Au Flash
200
µ”
Sn/Pb 200
µ”
Sn/Pb
FIG. 4
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
PAGE 43 | INTERCONNECTS
FIG. 4
833 XX _ _ _ 10 001000
Microchip MCU
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