PL
IA
NT
Features
n
Maximum height of 1.8 mm
n
Current up to 2.2 A
n
RoHS compliant*
Applications
n
Input/output of DC/DC converters
n
Power supplies for:
*R
oH
S
C
OM
A
F
RE
E
• Portable communication equipment
• Camcorders
• LCD TVs
LE
AD
SRU2016 Series - Shielded SMD Power Inductors
General Specifications
Test Voltage ....................................0.1 V
Reflow Soldering .. 230 °C, 50 sec. max.
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-40 °C to +125 °C
Resistance to Soldering Heat
............................... 260 °C for 10 sec.
Moisture Sensitivity Level ...................... 1
ESD Classification (HBM) .................. N/A
Materials
Core ....................Ferrite DR and RI core
Wire ............................Enameled copper
Terminal ....................................Ag/Ni/Sn
Rated Current
...................Ind. drop 35 % typ. at Isat
Temperature Rise
.....................40 °C max. at rated Irms
Packaging ................. 1,000 pcs. per reel
Product Dimensions
2.80 ± 0.20
(.110 ± .008)
2.80 ± 0.20
(.110 ± .008)
Electrical Specifications
Bourns
Part No.
Q
Ref.
Test
Freq.
(MHz)
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
SRU2016-1R0Y
SRU2016-2R2Y
SRU2016-3R0Y
SRU2016-4R7Y
SRU2016-6R0Y
SRU2016-100Y
SRU2016-150Y
SRU2016-220Y
SRU2016-330Y
SRU2016-470Y
SRU2016-680Y
SRU2016-101Y
Inductance
100 KHz
Tol.
(µH)
%
1.0
2.2
3.0
4.7
6.0
10
15
22
33
47
68
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
8
8
8
8
9
9
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
SRF
Typ.
(MHz)
250
120
90
80
70
45
40
30
20
20
15
10
RDC
Max.
(mW)
60
105
135
215
250
430
650
990
Irms
Max.
(A)
2.20
1.60
1.50
1.15
0.90
0.87
0.60
0.43
0.41
0.31
0.22
0.19
1.60
1.00
0.87
0.74
0.63
0.52
0.40
0.37
0.29
Isat
Typ.
(A)
Marking
A
C
E
F
**K-
Factor
2170
1485
1227
973
855
627
514
448
376
303
233
209
G
H
J
I
10
12
12
15
18
8
1470
1650
3510
4900
100
0.22
2.80 ± 0.20
(.110 ± .008)
0.17
0.15
K
M
N
L
**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x
Δ
I (peak-to-peak ripple current, A),
determine core loss from
Core Loss vs. Flux Density
plot.
Core Loss vs. Flux Density
100
SRU2016
A
10
Core Loss (mW)
1.65 ± 0.15
(.065 ± .006)
1
1 MHz
500 KHz
300 KHz
0.90
200 KHz
(.035)
100 KHz
TYP.
50 KHz
A
0.1
2.80 ± 0.20
(.110 ± .008)
0.01
100
1000
10000
0.90
(.035)
TYP.
0.90
TYP.
(.035)
1.65 ± 0.15
(.065 ± .006)
Flux Density Bp-p (gauss)
Electrical Schematic
Recommended Layout
REF.
0.65
(.026)
1.30
(.051)
REF.
3.00
(.118)
REF.
1.20
(.047)
REF.
0.90
(.035)
TYP.
0.90
(.035)
TYP.
0.90
TYP.
(.035)
* RoHS Directive 2002/95/EC Jan. 27, 2003 including
annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data
sheet can and do vary in different applications and
actual device performance may vary over time.
Users should verify actual device performance in their
specific applications.
2.10
(.083)
REF.
1.00
REF.
(.039)
LCR METER
1.00
(.039)
REF.
1.20
(.047)
REF.
0.65
(.026)
MM
DIMENSIONS:
(INCHES)
REF.
3.00
(.118)
REF.
0.65
REF.
(.026)
1.24
(.049)
REF.
1.30
(.051)
REF.
1.20
(.047)
REF.
2.10
1.00
REF.
SRF0504 Series - Line Filter
SRU2016 Series - Shielded SMD Power Inductors
Packaging Specifications
178.0
DIA.
(7.008)
178.0
2.0 ± 0.5
DIA.
2.0 ± 0.5
16.5
(7.008)
(.079 ± .020)
(.079 ± .020)
(.650)
16.5
(.650)
COVER
TAPE
EMBOSSED
CAVITY
21.0 ± 0.8
21.0 ± 0.8
(.827 ± .031)
(.827 ± .031)
13.0 ± 0.5
13.0 ± 0.5
(.512 ± .020)
(.512 ± .020)
DIA.
DIA.
50.0
(1.969)
50.0
(1.969)
13.0 ± 0.5
13.0 ± 0.5
DIA.
DIA.
(.512 ± .020)
(.512 ± .020)
14.0
(.551)
14.0
(.551)
EMBOSSED
CARRIER
12.0
(.472)
END
4
(.157)
START
A
A
A
A
8
(.315)
NO COMPONENT
200
(7.874)
NO COMPONENT
COMPONENTS
400
(15.748)
USER DIRECTION OF FEED
QTY: 1,000 PCS. PER REEL
MM
DIMENSIONS:
(INCHES)
REV. 03/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.