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74LVC2GU04GV

Description
Dual inverter
Categorylogic    logic   
File Size84KB,15 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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74LVC2GU04GV Overview

Dual inverter

74LVC2GU04GV Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSOP, TSOP6,.11,37
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G6
JESD-609 codee3
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP
Encapsulate equivalent codeTSOP6,.11,37
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
method of packingTAPE AND REEL
power supply3.3 V
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.95 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
74LVC2GU04
Dual inverter
Product specification
Supersedes data of 2004 May 24
2004 Sep 21

74LVC2GU04GV Related Products

74LVC2GU04GV 74LVC2GU04 74LVC2GU04GM 74LVC2GU04GW
Description Dual inverter Dual inverter Dual inverter Dual inverter
Is it Rohs certified? conform to - incompatible conform to
Maker Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSOP, TSOP6,.11,37 - SON, SOLCC6,.04,20 TSSOP, TSSOP6,.08
Reach Compliance Code unknown - unknown unknown
JESD-30 code R-PDSO-G6 - R-PDSO-N6 R-PDSO-G6
JESD-609 code e3 - e0 e3
Load capacitance (CL) 50 pF - 50 pF 50 pF
Logic integrated circuit type INVERTER - INVERTER INVERTER
MaximumI(ol) 0.024 A - 0.024 A 0.024 A
Number of terminals 6 - 6 6
Maximum operating temperature 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP - SON TSSOP
Encapsulate equivalent code TSOP6,.11,37 - SOLCC6,.04,20 TSSOP6,.08
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL - TAPE AND REEL TAPE AND REEL
power supply 3.3 V - 3.3 V 3.3 V
Certification status Not Qualified - Not Qualified Not Qualified
Schmitt trigger NO - NO NO
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) - Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal form GULL WING - NO LEAD GULL WING
Terminal pitch 0.95 mm - 0.5 mm 0.635 mm
Terminal location DUAL - DUAL DUAL
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