NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and
data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement
and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required.
Specifications are typical and may not apply to all applications.
BestCap Ultra-low ESR
High Power Pulse Supercapacitors
®
INTRODUCING
BESTCAP
®
: A NEW GENERATION OF PULSE SUPERCAPACITORS
Supercapacitors (also referred to as Electrochemical
Capacitors or Double Layer Capacitors) have rapidly become
recognized, not only as an excellent compromise between
“electronic” or “dielectric” capacitors such as ceramic,
tantalum, film and aluminum electrolytic, and batteries (Figure
1), but also as a valuable technology for providing a unique
combination of characteristics, particularly very high energy,
power and capacitance densities.
There are, however, two limitations associated with
conventional supercapacitors, namely: high ESR in the tens
of Ohms range, and high capacitance loss when required to
supply very short duration current pulses. BestCap
®
successfully addresses both of these limitations.
The capacitance loss in the millisecond region is caused by
the charge transfer (i.e. establishment of capacitance) being
carried out primarily by relatively slow moving ions in double
layer capacitors.
Figure 1. Specific Energy of Capacitor Types
10000
SPECIFIC ENERGY
1000
Specific Energy (mFV/cc)
®
100
UM
AL
NT
TA
ER IC
T
YM
OL ROLY M
P T
C MINU
E
EL LU
A
ELECTROLYTIC
CAPACITOR
10
0.1
1
10
100
1000
1
10000
Capacitance (mF)
In the above-mentioned “electronic” capacitors, the charge
transfer is performed by fast electrons, thereby creating
virtually instant rated capacitance value. In the BestCap
®
, a
unique proton polymer membrane is used – charge transfer
by protons is close to the transfer rate for electrons and
orders of magnitude greater than organic molecules. Figure
2 below illustrates the severe capacitance loss experienced
by several varieties of supercapacitors under short pulse
width conditions. It can also be seen from Figure 2 how well
BestCap
®
retains its capacitance with reducing pulse widths.
For comparison purposes, the characteristic of an equivalent
capacitance value aluminum electrolytic capacitor is shown
in Figure 2. The electrolytic capacitor is many times the vol-
ume of the BestCap
®
.
Figure 2. Actual Capacitance vs. Pulse Width
Actual Cap. (% of Nominal)
100%
80%
®
EDLC-Electrochemical
double layer capacitor
Aluminum Electrolytic Capacitor
manufacturer A EDLC
manufacturer B EDLC
manufacturer C EDLC
60%
40%
20%
0%
1000
100
Pulse Width (msec)
10
1
2
BestCap Ultra-low ESR
High Power Pulse Supercapacitors
®
BESTCAP
®
– A SERIES – MAXIMUM CAPACITANCE, LOW ESR
B SERIES – LOW PROFILE, LOW ESR
The BestCap
®
is a low profile device available in four case sizes. Capacitance range is from 6.8mF to 1000mF and includes 7
voltage ratings from 3.6V to 16V.
BESTCAP
®
– AVAILABLE LEAD CONFIGURATIONS
STANDARD:
N-Style: Two Terminal Planar Mount
(Available in BZ01, BZ05, BZ09 case only)
S-Style: Three Terminal Planar Mount
(Available in BZ01, BZ05, BZ09 case only)
L-Style: Four Terminal Planar Mount
(Available in BZ01 and BZ02 case only)
A Style: Through-Hole Mount
(Available in BZ01, BZ02 case only)
H-Style: Extended Stand-Off Through Hole Mount
(Available in BZ01, BZ02 case only)
W-Style: Wire Lead Mount
(Available in BZ01, BZ05 case only)
BODY DIMENSIONS
Case Size
BZ01
BZ02
BZ05
BZ09
L ±0.5 (0.020)
mm (inches)
28 (1.102)
48 (1.890)
20 (0.787)
17 (0.669)
W ±0.2 (0.008)
mm (inches)
17 (0.669)
30 (1.181)
15 (0.590)
15 (0.590)
H nom
mm (inches)
2.3 (0.091) – 6.5 (0.256)
2.9 (0.114) – 6.8 (0.268)
2.3 (0.091) – 6.5 (0.256)
2.3 (0.091)
LEAD-FREE COMPATIBLE
COMPONENT
ELECTRICAL SPECIFICATIONS
Capacitance range:
Capacitance tolerance:
Voltage ratings (max):
Test voltages:
Surge test voltage:
Temperature range:
Full dimensional specifications shown in section (2)
6.8mF – 1000mF
+80% / –20%
3.6V
4.5V
5.5V
9V
12V
15V
16V
3.5V
4.2V
5.0V
8.4V
10.0V 11.0V 13.0V
4.5V
5.6V
6.9V 11.3V 15.0V 18.8V 20.0V
–20°C to 70°C, consult factory for -40ºC and +75ºC options
20V
16.0V
25.0V
HOW TO ORDER
BZ
BestCap
®
(See Detailed Electrical Specifications for valid combinations)
[url=http://pan.baidu.com/s/1i3CFHfZ]Microcontroller C Language[/url] The information comes from the Internet. If there is any offense, please contact me and I will delete it immediately. Thank you!...
When doing post-simulation and reaching the post-map simulation step, the Map passed in ISE, but when calling ModelSim simulation, a bunch of the following problems appeared. I really don’t know how t...
How can I check the running time of a certain code in CCS? I found a CCS tutorial online that said there is a clock button on the toolbar that can be used to check the code execution time, but I have ...
TI Texas Instruments White LED Drivers TPS60250 1.2A High Power Efficiency Charge Pump for 7 WLEDs with I2C Interface TPS60251 1.2A High Power Efficiency Charge Pump for 7 WLEDs with I2C Interface TPS...
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
Most of the houses we live in now are elevator buildings, mainly because it is more convenient to go up and down the stairs! It can also make life more comfortable. It even helps to increase the ad...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
In recent years, many people have switched to new energy vehicles, and this type of vehicle has indeed been highly sought after and is considered the future direction of automobile development, and...[Details]
According to foreign media reports, researchers at the University of Surrey have developed an artificial intelligence system that can accurately locate the location of equipment in densely populate...[Details]
On August 22, according to the Ministry of Industry and Information Technology's official website, my country's first mandatory national standard for the control of hazardous substances in electric...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
Tires are a very important component for cars. They are related to the driving experience of the vehicle. We are almost inseparable from cars in our daily lives. For tires, according to the role of...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
HTTP is the abbreviation of Hypertext Transfer Protocol. It is an application protocol based on TCP/IP communication protocol used to transmit HTML and image files. It is an application-level objec...[Details]
Shanghai, China, August 21, 2025 –
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced the launch of the TLX9161T
, an automotive photorelay in a compact SO12L-T pa...[Details]
AI distributed rendering architecture improves mobile phone rendering capabilities, and game performance tests can check frame generation indicators in real time
Shanghai, China, Aug...[Details]
Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
On August 20, Reuters reported that two sources revealed that U.S. Commerce Secretary Howard Lutnick is exploring the possibility of using CHIPS Act funds in exchange for equity stakes in chip manu...[Details]
51mcu
京公网安备 11010802033920号
EEWORLD
