[i=s]This post was last edited by fxyc87 on 2022-3-21 16:37[/i]My history posts:
[RVB2601 Creative Application Development] @fxyc87 RVB2601 Unboxing + hello_world
Flathead RVB2601 creative application...
I was reading MSDN today and found a paragraph that I don't know how to understand. Can anyone explain it to me? In Windows Embedded CE 6.0, it is no longer necessary to build a profiling OAL over a n...
Introduction[table][tr][td] [/td][/tr][/table] Digital phase-locked loop (DPLL) technology has been widely used in many fields such as digital communication and radio electronics. Compared with the tr...
R329 Development Board Unboxing Experience
It has been about 10 days since I got the board. Refer to https://bbs.eeworld.com.cn/thread-1173908-1-1.html to light up the screen. Below is my unboxing exp...
There is a MSP430G2452 chip in the launchpad, but I can't find its data sheet? Also, I can't find this chip in the configuration options in IAR for MSP430 v4. Can someone help me?...
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
With the rapid development of technology, automotive intelligence is increasing at an unprecedented rate. This not only enhances vehicle functionality and comfort, but also places higher deman...[Details]
In recent years, the government has increasingly supported electric vehicles, and the number of electric vehicles has increased. Observant drivers will notice that there are many more green license...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Common Mode Semiconductor has officially released its latest generation of power management ICs—the GM6506 series. This fully integrated high-frequency synchronous rectification step-down p...[Details]
With the rapid development of electric vehicles in my country, people are beginning to pay attention to the issue of radiation from electric vehicles. We all know that mobile phones emit radiation,...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
There are more and more electric vehicles. Recently, I have heard some news about electric vehicles performing poorly in winter. I would like to briefly introduce whether heat pump technology is mo...[Details]
Speaking of the problem of vehicle spontaneous combustion, whether it is a pure electric vehicle or a fuel vehicle, there will be incidents of spontaneous combustion. For the same spontaneous combu...[Details]
introduction
In today's busy society, people experience chronic high stress, which in turn poses a significant threat to our health. Therefore, effectively relieving stress has become a pr...[Details]
The "China Electric Vehicle Charging Equipment Development Report (2024)" was compiled by the China Electric Vehicle Charging Infrastructure Promotion Alliance and Shenzhen Shenghong Electric Co., ...[Details]
Trump Says Chips Will Be Subject to a 100% Tariff, Exempting US Factories
According to CCTV News, US President Trump recently stated that the US will impose tariffs of approximately 100% o...[Details]
On August 14, Chinese researchers broke through the bottleneck of energy density and application performance of existing traditional lithium-ion batteries and developed soft-pack batteries with an ...[Details]