Support Device
| ATFS10 | ATFS05 | ATFS05-CC | ATFS05-CI | ATFS10-CC | ATFS10-CI | ATFS40 | ATFS40-CC | ATFS40-CI | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Support Device | Support Device | Support Device | Support Device | Support Device | Support Device | Support Device | Support Device | Support Device |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible | incompatible | - | incompatible | incompatible |
| Maker | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) |
| Parts packaging code | - | - | SOIC | SOIC | SOIC | SOIC | - | SOIC | SOIC |
| package instruction | - | - | SON, SOLCC8,.25 | SON, SOLCC8,.25 | SON, SOLCC8,.25 | SON, SOLCC8,.25 | - | TSON, SOLCC8,.25 | TSON, SOLCC8,.25 |
| Contacts | - | - | 8 | 8 | 8 | 8 | - | 8 | 8 |
| Reach Compliance Code | - | - | compli | compli | compli | compli | - | compli | compli |
| ECCN code | - | - | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | - | - | 10 MHz | 10 MHz | 15 MHz | 15 MHz | - | 15 MHz | 10 MHz |
| JESD-30 code | - | - | R-XDSO-N8 | R-XDSO-N8 | R-XDSO-N8 | R-XDSO-N8 | - | S-PDSO-N8 | S-PDSO-N8 |
| JESD-609 code | - | - | e0 | e0 | e0 | e0 | - | e0 | e0 |
| length | - | - | 5.99 mm | 5.99 mm | 5.99 mm | 5.99 mm | - | 6 mm | 6 mm |
| memory density | - | - | 284992 bi | 284992 bi | 750400 bi | 750400 bi | - | 815382 bi | 815382 bi |
| Memory IC Type | - | - | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | - | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| memory width | - | - | 1 | 1 | 1 | 1 | - | 1 | 1 |
| Humidity sensitivity level | - | - | 3 | 3 | 3 | 3 | - | 3 | 3 |
| Number of functions | - | - | 1 | 1 | 1 | 1 | - | 1 | 1 |
| Number of terminals | - | - | 8 | 8 | 8 | 8 | - | 8 | 8 |
| word count | - | - | 284992 words | 284992 words | 750400 words | 750400 words | - | 815382 words | 815382 words |
| character code | - | - | 284992 | 284992 | 750400 | 750400 | - | 815382 | 815382 |
| Operating mode | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | - | 70 °C | 85 °C | 70 °C | 85 °C | - | 70 °C | 85 °C |
| organize | - | - | 284992X1 | 284992X1 | 750400X1 | 750400X1 | - | 815382X1 | 815382X1 |
| Package body material | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | SON | SON | SON | SON | - | TSON | TSON |
| Encapsulate equivalent code | - | - | SOLCC8,.25 | SOLCC8,.25 | SOLCC8,.25 | SOLCC8,.25 | - | SOLCC8,.25 | SOLCC8,.25 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE | SQUARE |
| Package form | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | - | - | SERIAL | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | - | - | 240 | 240 | 240 | 240 | - | 240 | 240 |
| power supply | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 1.14 mm | 1.14 mm | 1.14 mm | 1.14 mm | - | 1.14 mm | 1.14 mm |
| Maximum standby current | - | - | 0.00005 A | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A | 0.0001 A |
| Maximum slew rate | - | - | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | - | 0.005 mA | 0.005 mA |
| Maximum supply voltage (Vsup) | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | - | - | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
| Nominal supply voltage (Vsup) | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| surface mount | - | - | YES | YES | YES | YES | - | YES | YES |
| technology | - | - | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| Temperature level | - | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - | COMMERCIAL | INDUSTRIAL |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD |
| Terminal pitch | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
| Terminal location | - | - | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | 30 | 30 | 30 | 30 | - | 30 | 30 |
| width | - | - | 5.99 mm | 5.99 mm | 5.99 mm | 5.99 mm | - | 6 mm | 6 mm |
京公网安备 11010802033920号
EEWORLD
